JPS4990893A - - Google Patents

Info

Publication number
JPS4990893A
JPS4990893A JP199773A JP199773A JPS4990893A JP S4990893 A JPS4990893 A JP S4990893A JP 199773 A JP199773 A JP 199773A JP 199773 A JP199773 A JP 199773A JP S4990893 A JPS4990893 A JP S4990893A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP199773A
Other languages
Japanese (ja)
Other versions
JPS5632796B2 (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP731997A priority Critical patent/JPS5632796B2/ja
Publication of JPS4990893A publication Critical patent/JPS4990893A/ja
Publication of JPS5632796B2 publication Critical patent/JPS5632796B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP731997A 1972-12-28 1972-12-28 Expired JPS5632796B2 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP731997A JPS5632796B2 (2) 1972-12-28 1972-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP731997A JPS5632796B2 (2) 1972-12-28 1972-12-28

Publications (2)

Publication Number Publication Date
JPS4990893A true JPS4990893A (2) 1974-08-30
JPS5632796B2 JPS5632796B2 (2) 1981-07-30

Family

ID=11517078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP731997A Expired JPS5632796B2 (2) 1972-12-28 1972-12-28

Country Status (1)

Country Link
JP (1) JPS5632796B2 (2)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4912881U (2) * 1972-05-11 1974-02-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4912881U (2) * 1972-05-11 1974-02-02

Also Published As

Publication number Publication date
JPS5632796B2 (2) 1981-07-30

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