JPS5632796B2 - - Google Patents
Info
- Publication number
- JPS5632796B2 JPS5632796B2 JP731997A JP199773A JPS5632796B2 JP S5632796 B2 JPS5632796 B2 JP S5632796B2 JP 731997 A JP731997 A JP 731997A JP 199773 A JP199773 A JP 199773A JP S5632796 B2 JPS5632796 B2 JP S5632796B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP731997A JPS5632796B2 (2) | 1972-12-28 | 1972-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP731997A JPS5632796B2 (2) | 1972-12-28 | 1972-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4990893A JPS4990893A (2) | 1974-08-30 |
| JPS5632796B2 true JPS5632796B2 (2) | 1981-07-30 |
Family
ID=11517078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP731997A Expired JPS5632796B2 (2) | 1972-12-28 | 1972-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5632796B2 (2) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4912881U (2) * | 1972-05-11 | 1974-02-02 |
-
1972
- 1972-12-28 JP JP731997A patent/JPS5632796B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4990893A (2) | 1974-08-30 |