JPS5010967A - - Google Patents
Info
- Publication number
- JPS5010967A JPS5010967A JP5866973A JP5866973A JPS5010967A JP S5010967 A JPS5010967 A JP S5010967A JP 5866973 A JP5866973 A JP 5866973A JP 5866973 A JP5866973 A JP 5866973A JP S5010967 A JPS5010967 A JP S5010967A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5866973A JPS5010967A (mo) | 1973-05-28 | 1973-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5866973A JPS5010967A (mo) | 1973-05-28 | 1973-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5010967A true JPS5010967A (mo) | 1975-02-04 |
Family
ID=13090981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5866973A Pending JPS5010967A (mo) | 1973-05-28 | 1973-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5010967A (mo) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH024263U (mo) * | 1988-06-20 | 1990-01-11 | ||
| JPH03152966A (ja) * | 1989-11-09 | 1991-06-28 | Nec Corp | 半導体装置用リードフレーム |
| JPH03252013A (ja) * | 1990-02-28 | 1991-11-11 | Matsushita Electric Ind Co Ltd | 節度付エンコーダ |
| JPH03256353A (ja) * | 1990-03-06 | 1991-11-15 | Toshiba Corp | 半導体装置 |
| JPH048446U (mo) * | 1990-05-07 | 1992-01-27 |
-
1973
- 1973-05-28 JP JP5866973A patent/JPS5010967A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH024263U (mo) * | 1988-06-20 | 1990-01-11 | ||
| JPH03152966A (ja) * | 1989-11-09 | 1991-06-28 | Nec Corp | 半導体装置用リードフレーム |
| JPH03252013A (ja) * | 1990-02-28 | 1991-11-11 | Matsushita Electric Ind Co Ltd | 節度付エンコーダ |
| JPH03256353A (ja) * | 1990-03-06 | 1991-11-15 | Toshiba Corp | 半導体装置 |
| JPH048446U (mo) * | 1990-05-07 | 1992-01-27 |