JPS5052974A - - Google Patents
Info
- Publication number
- JPS5052974A JPS5052974A JP48100169A JP10016973A JPS5052974A JP S5052974 A JPS5052974 A JP S5052974A JP 48100169 A JP48100169 A JP 48100169A JP 10016973 A JP10016973 A JP 10016973A JP S5052974 A JPS5052974 A JP S5052974A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Jigs For Machine Tools (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10016973A JPS5635022B2 (2) | 1973-09-07 | 1973-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10016973A JPS5635022B2 (2) | 1973-09-07 | 1973-09-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5052974A true JPS5052974A (2) | 1975-05-10 |
| JPS5635022B2 JPS5635022B2 (2) | 1981-08-14 |
Family
ID=14266804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10016973A Expired JPS5635022B2 (2) | 1973-09-07 | 1973-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5635022B2 (2) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59132640A (ja) * | 1983-01-20 | 1984-07-30 | Nec Corp | 半導体素子用リ−ドフレ−ム |
| JPS637418U (2) * | 1986-06-30 | 1988-01-19 | ||
| JPH02177990A (ja) * | 1988-12-28 | 1990-07-11 | Kaijirushi Hamono Kaihatsu Center:Kk | 鋏における刀身の取付構造 |
| JPH0310722A (ja) * | 1989-06-08 | 1991-01-18 | Zexel Corp | プリント基板の位置決め装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6037843U (ja) * | 1983-08-23 | 1985-03-15 | 株式会社村田製作所 | 音叉振動子を用いた荷重検出装置 |
-
1973
- 1973-09-07 JP JP10016973A patent/JPS5635022B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59132640A (ja) * | 1983-01-20 | 1984-07-30 | Nec Corp | 半導体素子用リ−ドフレ−ム |
| JPS637418U (2) * | 1986-06-30 | 1988-01-19 | ||
| JPH02177990A (ja) * | 1988-12-28 | 1990-07-11 | Kaijirushi Hamono Kaihatsu Center:Kk | 鋏における刀身の取付構造 |
| JPH0310722A (ja) * | 1989-06-08 | 1991-01-18 | Zexel Corp | プリント基板の位置決め装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5635022B2 (2) | 1981-08-14 |