JPS5072838A - - Google Patents

Info

Publication number
JPS5072838A
JPS5072838A JP49093472A JP9347274A JPS5072838A JP S5072838 A JPS5072838 A JP S5072838A JP 49093472 A JP49093472 A JP 49093472A JP 9347274 A JP9347274 A JP 9347274A JP S5072838 A JPS5072838 A JP S5072838A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49093472A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5072838A publication Critical patent/JPS5072838A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP49093472A 1973-08-20 1974-08-16 Pending JPS5072838A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38957973A 1973-08-20 1973-08-20
US48227974A 1974-06-24 1974-06-24

Publications (1)

Publication Number Publication Date
JPS5072838A true JPS5072838A (fr) 1975-06-16

Family

ID=27012758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49093472A Pending JPS5072838A (fr) 1973-08-20 1974-08-16

Country Status (10)

Country Link
JP (1) JPS5072838A (fr)
CA (1) CA1045577A (fr)
CH (1) CH592167A5 (fr)
DE (1) DE2439656C2 (fr)
FR (1) FR2241632B1 (fr)
GB (1) GB1484575A (fr)
IL (1) IL45382A (fr)
IT (1) IT1057888B (fr)
NL (1) NL7411119A (fr)
SE (2) SE413910B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016098669A1 (ja) * 2014-12-15 2017-06-15 千住金属工業株式会社 めっき用はんだ合金および電子部品

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL189310C (nl) * 1984-05-18 1993-03-01 Toyo Kohan Co Ltd Beklede stalen plaat met verbeterde lasbaarheid en werkwijze voor de vervaardiging.
EP2233611A1 (fr) * 2009-03-24 2010-09-29 MTV Metallveredlung GmbH & Co. KG Système de couche doté d'une résistance améliorée à la corrosion

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2141940C2 (de) * 1971-08-21 1977-02-10 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten Galvanisches bad zum abscheiden von zinn/nickel-, zinn/kobalt- oder zinn/nickel/kobalt-schichten und zugehoeriges galvanisierverfahren

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016098669A1 (ja) * 2014-12-15 2017-06-15 千住金属工業株式会社 めっき用はんだ合金および電子部品

Also Published As

Publication number Publication date
FR2241632B1 (fr) 1979-08-03
IL45382A (en) 1976-09-30
CH592167A5 (fr) 1977-10-14
GB1484575A (en) 1977-09-01
SE413910B (sv) 1980-06-30
DE2439656C2 (de) 1983-06-16
SE7410531L (fr) 1975-02-21
NL7411119A (nl) 1975-02-24
SE7804535L (sv) 1978-04-20
IT1057888B (it) 1982-03-30
DE2439656A1 (de) 1975-03-06
IL45382A0 (en) 1974-11-29
FR2241632A1 (fr) 1975-03-21
CA1045577A (fr) 1979-01-02

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