SE7410531L - - Google Patents

Info

Publication number
SE7410531L
SE7410531L SE7410531A SE7410531A SE7410531L SE 7410531 L SE7410531 L SE 7410531L SE 7410531 A SE7410531 A SE 7410531A SE 7410531 A SE7410531 A SE 7410531A SE 7410531 L SE7410531 L SE 7410531L
Authority
SE
Sweden
Application number
SE7410531A
Other versions
SE413910B (sv
Inventor
M H Pollack
Original Assignee
Nasglo International Corp Flus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nasglo International Corp Flus filed Critical Nasglo International Corp Flus
Publication of SE7410531L publication Critical patent/SE7410531L/xx
Publication of SE413910B publication Critical patent/SE413910B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE7410531A 1973-08-20 1974-08-19 Sett och bad for elektrolytisk utfellning av en legering av nickel och tenn SE413910B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38957973A 1973-08-20 1973-08-20
US48227974A 1974-06-24 1974-06-24

Publications (2)

Publication Number Publication Date
SE7410531L true SE7410531L (fr) 1975-02-21
SE413910B SE413910B (sv) 1980-06-30

Family

ID=27012758

Family Applications (2)

Application Number Title Priority Date Filing Date
SE7410531A SE413910B (sv) 1973-08-20 1974-08-19 Sett och bad for elektrolytisk utfellning av en legering av nickel och tenn
SE7804535A SE7804535L (sv) 1973-08-20 1978-04-20 Tenn-nickellegering

Family Applications After (1)

Application Number Title Priority Date Filing Date
SE7804535A SE7804535L (sv) 1973-08-20 1978-04-20 Tenn-nickellegering

Country Status (10)

Country Link
JP (1) JPS5072838A (fr)
CA (1) CA1045577A (fr)
CH (1) CH592167A5 (fr)
DE (1) DE2439656C2 (fr)
FR (1) FR2241632B1 (fr)
GB (1) GB1484575A (fr)
IL (1) IL45382A (fr)
IT (1) IT1057888B (fr)
NL (1) NL7411119A (fr)
SE (2) SE413910B (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL189310C (nl) * 1984-05-18 1993-03-01 Toyo Kohan Co Ltd Beklede stalen plaat met verbeterde lasbaarheid en werkwijze voor de vervaardiging.
EP2233611A1 (fr) * 2009-03-24 2010-09-29 MTV Metallveredlung GmbH & Co. KG Système de couche doté d'une résistance améliorée à la corrosion
ES2764394T3 (es) * 2014-12-15 2020-06-03 Senju Metal Industry Co Aleación de soldadura para galvanización y componentes electrónicos

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2141940C2 (de) * 1971-08-21 1977-02-10 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten Galvanisches bad zum abscheiden von zinn/nickel-, zinn/kobalt- oder zinn/nickel/kobalt-schichten und zugehoeriges galvanisierverfahren

Also Published As

Publication number Publication date
FR2241632B1 (fr) 1979-08-03
IL45382A (en) 1976-09-30
CH592167A5 (fr) 1977-10-14
GB1484575A (en) 1977-09-01
SE413910B (sv) 1980-06-30
DE2439656C2 (de) 1983-06-16
NL7411119A (nl) 1975-02-24
SE7804535L (sv) 1978-04-20
JPS5072838A (fr) 1975-06-16
IT1057888B (it) 1982-03-30
DE2439656A1 (de) 1975-03-06
IL45382A0 (en) 1974-11-29
FR2241632A1 (fr) 1975-03-21
CA1045577A (fr) 1979-01-02

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