JPS5081475A - - Google Patents
Info
- Publication number
- JPS5081475A JPS5081475A JP48131074A JP13107473A JPS5081475A JP S5081475 A JPS5081475 A JP S5081475A JP 48131074 A JP48131074 A JP 48131074A JP 13107473 A JP13107473 A JP 13107473A JP S5081475 A JPS5081475 A JP S5081475A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48131074A JPS5081475A (2) | 1973-11-19 | 1973-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48131074A JPS5081475A (2) | 1973-11-19 | 1973-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5081475A true JPS5081475A (2) | 1975-07-02 |
Family
ID=15049372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48131074A Pending JPS5081475A (2) | 1973-11-19 | 1973-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5081475A (2) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55111151A (en) * | 1979-02-20 | 1980-08-27 | Nec Corp | Integrated circuit device |
| JPS5731166A (en) * | 1980-07-31 | 1982-02-19 | Fujitsu Ltd | Semiconductor device |
| JPS57106230U (2) * | 1980-12-22 | 1982-06-30 | ||
| JPS57160155A (en) * | 1981-03-27 | 1982-10-02 | Mitsubishi Electric Corp | Multi-layer semiconductor integrated circuit |
| JPS5837947A (ja) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | 半導体装置 |
| JPS5892230A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | 半導体装置 |
| JPS5892258A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | 集積回路素子 |
| JPS59143354A (ja) * | 1983-02-04 | 1984-08-16 | Mitsubishi Electric Corp | 半導体集積回路装置 |
| JP2002217357A (ja) * | 2001-01-19 | 2002-08-02 | Kyocera Corp | 半導体装置 |
| JP2015153985A (ja) * | 2014-02-18 | 2015-08-24 | 株式会社デンソー | 半導体パッケージ |
-
1973
- 1973-11-19 JP JP48131074A patent/JPS5081475A/ja active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55111151A (en) * | 1979-02-20 | 1980-08-27 | Nec Corp | Integrated circuit device |
| JPS5731166A (en) * | 1980-07-31 | 1982-02-19 | Fujitsu Ltd | Semiconductor device |
| JPS57106230U (2) * | 1980-12-22 | 1982-06-30 | ||
| JPS57160155A (en) * | 1981-03-27 | 1982-10-02 | Mitsubishi Electric Corp | Multi-layer semiconductor integrated circuit |
| JPS5837947A (ja) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | 半導体装置 |
| JPS5892230A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | 半導体装置 |
| JPS5892258A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | 集積回路素子 |
| JPS59143354A (ja) * | 1983-02-04 | 1984-08-16 | Mitsubishi Electric Corp | 半導体集積回路装置 |
| JP2002217357A (ja) * | 2001-01-19 | 2002-08-02 | Kyocera Corp | 半導体装置 |
| JP2015153985A (ja) * | 2014-02-18 | 2015-08-24 | 株式会社デンソー | 半導体パッケージ |