JPS5093569A - - Google Patents
Info
- Publication number
- JPS5093569A JPS5093569A JP14314973A JP14314973A JPS5093569A JP S5093569 A JPS5093569 A JP S5093569A JP 14314973 A JP14314973 A JP 14314973A JP 14314973 A JP14314973 A JP 14314973A JP S5093569 A JPS5093569 A JP S5093569A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Element Separation (AREA)
- Weting (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14314973A JPS5223219B2 (de) | 1973-12-19 | 1973-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14314973A JPS5223219B2 (de) | 1973-12-19 | 1973-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5093569A true JPS5093569A (de) | 1975-07-25 |
| JPS5223219B2 JPS5223219B2 (de) | 1977-06-22 |
Family
ID=15332055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14314973A Expired JPS5223219B2 (de) | 1973-12-19 | 1973-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5223219B2 (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01251636A (ja) * | 1988-03-31 | 1989-10-06 | Toshiba Corp | 誘電体分離ウェハの製造方法 |
| JPH02228061A (ja) * | 1989-03-01 | 1990-09-11 | Nippon Telegr & Teleph Corp <Ntt> | Ｓｏｉ基板の製造方法 |
| US11646562B2 (en) | 2019-09-17 | 2023-05-09 | National University Corporation Saitama University | Devices and methods for current interrupting using current diversion path |
-
1973
- 1973-12-19 JP JP14314973A patent/JPS5223219B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01251636A (ja) * | 1988-03-31 | 1989-10-06 | Toshiba Corp | 誘電体分離ウェハの製造方法 |
| JPH02228061A (ja) * | 1989-03-01 | 1990-09-11 | Nippon Telegr & Teleph Corp <Ntt> | Ｓｏｉ基板の製造方法 |
| US11646562B2 (en) | 2019-09-17 | 2023-05-09 | National University Corporation Saitama University | Devices and methods for current interrupting using current diversion path |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5223219B2 (de) | 1977-06-22 |