JPS5099684A - - Google Patents

Info

Publication number
JPS5099684A
JPS5099684A JP49000734A JP73474A JPS5099684A JP S5099684 A JPS5099684 A JP S5099684A JP 49000734 A JP49000734 A JP 49000734A JP 73474 A JP73474 A JP 73474A JP S5099684 A JPS5099684 A JP S5099684A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49000734A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49000734A priority Critical patent/JPS5099684A/ja
Publication of JPS5099684A publication Critical patent/JPS5099684A/ja
Pending legal-status Critical Current

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  • Mechanical Treatment Of Semiconductor (AREA)
JP49000734A 1973-12-29 1973-12-29 Pending JPS5099684A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49000734A JPS5099684A (ja) 1973-12-29 1973-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49000734A JPS5099684A (ja) 1973-12-29 1973-12-29

Publications (1)

Publication Number Publication Date
JPS5099684A true JPS5099684A (ja) 1975-08-07

Family

ID=11481943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49000734A Pending JPS5099684A (ja) 1973-12-29 1973-12-29

Country Status (1)

Country Link
JP (1) JPS5099684A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59136934A (ja) * 1983-01-27 1984-08-06 Nec Corp 半導体装置の製造方法
JPS647548A (en) * 1987-01-09 1989-01-11 Philips Nv Manufacture of semiconductor device
US5705028A (en) * 1993-04-21 1998-01-06 Yamaha Corporation Method of manufacturing a semiconductor device with flattened multi-layer wirings

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59136934A (ja) * 1983-01-27 1984-08-06 Nec Corp 半導体装置の製造方法
JPS647548A (en) * 1987-01-09 1989-01-11 Philips Nv Manufacture of semiconductor device
US5705028A (en) * 1993-04-21 1998-01-06 Yamaha Corporation Method of manufacturing a semiconductor device with flattened multi-layer wirings

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