JPS51112279A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS51112279A
JPS51112279A JP50036703A JP3670375A JPS51112279A JP S51112279 A JPS51112279 A JP S51112279A JP 50036703 A JP50036703 A JP 50036703A JP 3670375 A JP3670375 A JP 3670375A JP S51112279 A JPS51112279 A JP S51112279A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
manufacturing
generated
air bubble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50036703A
Other languages
Japanese (ja)
Inventor
Asaichi Koichi
Shuji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50036703A priority Critical patent/JPS51112279A/en
Publication of JPS51112279A publication Critical patent/JPS51112279A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: A method of manufacturing a semiconductor in which no air bubble is generated at the connected portion.
COPYRIGHT: (C)1976,JPO&Japio
JP50036703A 1975-03-28 1975-03-28 Semiconductor device Pending JPS51112279A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50036703A JPS51112279A (en) 1975-03-28 1975-03-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50036703A JPS51112279A (en) 1975-03-28 1975-03-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS51112279A true JPS51112279A (en) 1976-10-04

Family

ID=12477118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50036703A Pending JPS51112279A (en) 1975-03-28 1975-03-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS51112279A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101743U (en) * 1983-12-16 1985-07-11 株式会社東芝 semiconductor equipment
CN113394118A (en) * 2020-03-13 2021-09-14 长鑫存储技术有限公司 Package structure and method for forming the same
US12424500B2 (en) 2021-01-22 2025-09-23 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS496636B1 (en) * 1969-02-07 1974-02-15
JPS506151A (en) * 1972-12-18 1975-01-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS496636B1 (en) * 1969-02-07 1974-02-15
JPS506151A (en) * 1972-12-18 1975-01-22

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101743U (en) * 1983-12-16 1985-07-11 株式会社東芝 semiconductor equipment
CN113394118A (en) * 2020-03-13 2021-09-14 长鑫存储技术有限公司 Package structure and method for forming the same
CN113394118B (en) * 2020-03-13 2022-03-18 长鑫存储技术有限公司 Package structure and method of forming the same
US12424500B2 (en) 2021-01-22 2025-09-23 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device

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