JPS5219071A - Production method of semiconductor device - Google Patents
Production method of semiconductor deviceInfo
- Publication number
- JPS5219071A JPS5219071A JP50095049A JP9504975A JPS5219071A JP S5219071 A JPS5219071 A JP S5219071A JP 50095049 A JP50095049 A JP 50095049A JP 9504975 A JP9504975 A JP 9504975A JP S5219071 A JPS5219071 A JP S5219071A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- production method
- connection
- provide good
- good result
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: A production method of semiconductor device which can always provide good result through simple inspection of the connection of lead lines.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50095049A JPS5219071A (en) | 1975-08-06 | 1975-08-06 | Production method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50095049A JPS5219071A (en) | 1975-08-06 | 1975-08-06 | Production method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5219071A true JPS5219071A (en) | 1977-01-14 |
Family
ID=14127192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50095049A Pending JPS5219071A (en) | 1975-08-06 | 1975-08-06 | Production method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5219071A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5574148A (en) * | 1978-11-29 | 1980-06-04 | Nec Corp | Production of semiconductor device |
-
1975
- 1975-08-06 JP JP50095049A patent/JPS5219071A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5574148A (en) * | 1978-11-29 | 1980-06-04 | Nec Corp | Production of semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS51135461A (en) | Exposing-method | |
| JPS51115775A (en) | Semiconductor apparatus | |
| JPS5255871A (en) | Production of semiconductor | |
| JPS5230167A (en) | Method for production of semiconductor device | |
| JPS51113478A (en) | The manufacturing method of semiconductor device | |
| JPS5210032A (en) | Construction method of semiconductor memory unit | |
| JPS51121651A (en) | Screw and its manufacturing method | |
| JPS51130176A (en) | Semiconductor device process | |
| JPS51121267A (en) | Semiconductor wafer measuring device | |
| JPS5223273A (en) | Method of manufacturing semiconductor element | |
| JPS51123086A (en) | Semicanductor device and its production process | |
| JPS51112279A (en) | Semiconductor device | |
| JPS547869A (en) | Lead bending method of semiconductor device | |
| JPS51134587A (en) | Production method of semiconductor integrated-circuit device | |
| JPS5245274A (en) | Method for inspection before perfection of transistor | |
| JPS51112292A (en) | Semiconductor device | |
| JPS51116994A (en) | Method for forming collection-distribution hole of transmission lead | |
| JPS51138166A (en) | Production method of semiconductor device | |
| JPS51122375A (en) | Semiconductor device | |
| JPS51115048A (en) | Soft water preparing apparatus | |
| JPS51138875A (en) | Intermittent elmination | |
| JPS51113469A (en) | Manufacturing method of semiconductor device | |
| JPS51140638A (en) | Positioning method | |
| JPS5233088A (en) | Method to manufacture a twist line tyupe lead | |
| JPS51151089A (en) | Manufacturing method of a semiconductor |