JPS51113465A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS51113465A
JPS51113465A JP50036970A JP3697075A JPS51113465A JP S51113465 A JPS51113465 A JP S51113465A JP 50036970 A JP50036970 A JP 50036970A JP 3697075 A JP3697075 A JP 3697075A JP S51113465 A JPS51113465 A JP S51113465A
Authority
JP
Japan
Prior art keywords
lead frame
assimilates
simplifying
intention
manufacturing process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50036970A
Other languages
English (en)
Inventor
Toshiro Iba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50036970A priority Critical patent/JPS51113465A/ja
Publication of JPS51113465A publication Critical patent/JPS51113465A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP50036970A 1975-03-28 1975-03-28 Lead frame Pending JPS51113465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50036970A JPS51113465A (en) 1975-03-28 1975-03-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50036970A JPS51113465A (en) 1975-03-28 1975-03-28 Lead frame

Publications (1)

Publication Number Publication Date
JPS51113465A true JPS51113465A (en) 1976-10-06

Family

ID=12484586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50036970A Pending JPS51113465A (en) 1975-03-28 1975-03-28 Lead frame

Country Status (1)

Country Link
JP (1) JPS51113465A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195843U (ja) * 1981-06-04 1982-12-11

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4971872A (ja) * 1972-11-10 1974-07-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4971872A (ja) * 1972-11-10 1974-07-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195843U (ja) * 1981-06-04 1982-12-11

Similar Documents

Publication Publication Date Title
JPS5253663A (en) Resin sealing mold
JPS5240062A (en) Process for production of semiconductor devices
JPS51113465A (en) Lead frame
JPS5278949A (en) Resin compositions having metallic luster
JPS5219747A (en) Polytetrafluoroethylene resin composition
JPS51149343A (en) Polypropylene resin composition with enhanced flame retardancy
JPS5296231A (en) Production of acetylcellulose pulp
JPS5212252A (en) Process for electrostatic flocking
JPS521096A (en) Process of manufacturing vinegar
JPS51149386A (en) A process for manufacturing sealing materials
JPS5231671A (en) Sealing method of semiconductor device
JPS5217766A (en) Production method of porous arsenic dope silicone
JPS51123074A (en) Production process of fet
JPS5219081A (en) Production method of semiconductor device
JPS51149345A (en) Manufacturing polyolfin resin composition
JPS51134742A (en) Molding composition
JPS51149344A (en) Process of manufacturing polyolefin resin composition
JPS51117983A (en) A process for producing a compound film
JPS5243566A (en) Adornment
JPS52179A (en) Method of fabricating semiconductor
JPS5247050A (en) Polyamide resin compositions
JPS51151793A (en) Moulding composition of phenolic resin and method for moulding the sam e
JPS51127145A (en) Thermoplastic composition
JPS5228543A (en) Process for preparing a molding material
JPS5221044A (en) Molding composition