JPS51114485A - Hot stamping on thermoplastic resin materials combined with thermal or dielectric embossing - Google Patents

Hot stamping on thermoplastic resin materials combined with thermal or dielectric embossing

Info

Publication number
JPS51114485A
JPS51114485A JP3925475A JP3925475A JPS51114485A JP S51114485 A JPS51114485 A JP S51114485A JP 3925475 A JP3925475 A JP 3925475A JP 3925475 A JP3925475 A JP 3925475A JP S51114485 A JPS51114485 A JP S51114485A
Authority
JP
Japan
Prior art keywords
thermoplastic resin
hot stamping
thermal
resin materials
materials combined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3925475A
Other languages
Japanese (ja)
Inventor
Hiroyuki Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP3925475A priority Critical patent/JPS51114485A/en
Publication of JPS51114485A publication Critical patent/JPS51114485A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: Method of efficiently hot stamping on a thermoplastic resin material, whereby fine letters and figures can be stamped clearly and firmly with no delamination due to abrasion.
COPYRIGHT: (C)1976,JPO&Japio
JP3925475A 1975-04-02 1975-04-02 Hot stamping on thermoplastic resin materials combined with thermal or dielectric embossing Pending JPS51114485A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3925475A JPS51114485A (en) 1975-04-02 1975-04-02 Hot stamping on thermoplastic resin materials combined with thermal or dielectric embossing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3925475A JPS51114485A (en) 1975-04-02 1975-04-02 Hot stamping on thermoplastic resin materials combined with thermal or dielectric embossing

Publications (1)

Publication Number Publication Date
JPS51114485A true JPS51114485A (en) 1976-10-08

Family

ID=12547993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3925475A Pending JPS51114485A (en) 1975-04-02 1975-04-02 Hot stamping on thermoplastic resin materials combined with thermal or dielectric embossing

Country Status (1)

Country Link
JP (1) JPS51114485A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427501A (en) * 1987-07-23 1989-01-30 Chikatsu Usui Stamping method to insole of shoes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427501A (en) * 1987-07-23 1989-01-30 Chikatsu Usui Stamping method to insole of shoes

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