JPS51114867A - Nailhead wire bonding method - Google Patents

Nailhead wire bonding method

Info

Publication number
JPS51114867A
JPS51114867A JP50039092A JP3909275A JPS51114867A JP S51114867 A JPS51114867 A JP S51114867A JP 50039092 A JP50039092 A JP 50039092A JP 3909275 A JP3909275 A JP 3909275A JP S51114867 A JPS51114867 A JP S51114867A
Authority
JP
Japan
Prior art keywords
wire bonding
nailhead
bonding method
wire
spool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50039092A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50039092A priority Critical patent/JPS51114867A/en
Publication of JPS51114867A publication Critical patent/JPS51114867A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: Wire bonding is done smoothly without producting broken wires by uncoiling the required length of the wire needed for a unit work quantity and fiving tension to the wire by rotationally supprting the spool with pneumatic pressure. The bonding is done next by stopping the rotational support of the spool by the pneumatic pressure.
COPYRIGHT: (C)1976,JPO&Japio
JP50039092A 1975-04-02 1975-04-02 Nailhead wire bonding method Pending JPS51114867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50039092A JPS51114867A (en) 1975-04-02 1975-04-02 Nailhead wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50039092A JPS51114867A (en) 1975-04-02 1975-04-02 Nailhead wire bonding method

Publications (1)

Publication Number Publication Date
JPS51114867A true JPS51114867A (en) 1976-10-08

Family

ID=12543422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50039092A Pending JPS51114867A (en) 1975-04-02 1975-04-02 Nailhead wire bonding method

Country Status (1)

Country Link
JP (1) JPS51114867A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518091A (en) * 1978-07-26 1980-02-07 Nec Corp Device for bonding wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518091A (en) * 1978-07-26 1980-02-07 Nec Corp Device for bonding wire

Similar Documents

Publication Publication Date Title
JPS51114867A (en) Nailhead wire bonding method
JPS5235604A (en) Tape feeding device free from iregular winding
JPS5229078A (en) Device for carrying to supply long post of different diameter
JPS5237019A (en) Tape takeup device
JPS5225570A (en) Wire bonding apparatus
JPS51124260A (en) Hoist
JPS5248082A (en) Cable winding apparatus
JPS52142485A (en) Wire bonding device
JPS5351370A (en) Tape dress winding device
JPS5271603A (en) Coil winding apparatus for wound type rotor
JPS52140803A (en) Drive means for constant-tension, speed-following type wire winder
JPS5246494A (en) Cutting machine
JPS51141947A (en) Device for supporting end of wire rope
JPS522278A (en) Device of bonding nail head of wire
JPS5279657A (en) Wire bonding device
JPS5324268A (en) Pro duction of semiconductor device and bonding wire for the same
JPS51136414A (en) Magnetic head device
JPS5270697A (en) Bundling member
JPS5424266A (en) Manufacture of lined-up pins' group
JPS524084A (en) Cord end molding method
JPS51135613A (en) Magnetic taping equipment
JPS5431709A (en) Tension adjuster of tape recorders
JPS51140567A (en) Method for composing semiconductor devices
JPS5227575A (en) Traversing device for wire winder
JPS532720A (en) Fastening method of hose connecting wire and device used in method