JPS5279657A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5279657A
JPS5279657A JP50157102A JP15710275A JPS5279657A JP S5279657 A JPS5279657 A JP S5279657A JP 50157102 A JP50157102 A JP 50157102A JP 15710275 A JP15710275 A JP 15710275A JP S5279657 A JPS5279657 A JP S5279657A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding device
bonded
metal wires
fine metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50157102A
Other languages
Japanese (ja)
Inventor
Masanori Tosa
Toshinobu Banjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50157102A priority Critical patent/JPS5279657A/en
Publication of JPS5279657A publication Critical patent/JPS5279657A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain a device for performing insulation covering to the fine metal wires to be bonded.
COPYRIGHT: (C)1977,JPO&Japio
JP50157102A 1975-12-25 1975-12-25 Wire bonding device Pending JPS5279657A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50157102A JPS5279657A (en) 1975-12-25 1975-12-25 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50157102A JPS5279657A (en) 1975-12-25 1975-12-25 Wire bonding device

Publications (1)

Publication Number Publication Date
JPS5279657A true JPS5279657A (en) 1977-07-04

Family

ID=15642267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50157102A Pending JPS5279657A (en) 1975-12-25 1975-12-25 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5279657A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538014A (en) * 1978-09-08 1980-03-17 Tdk Corp Wire bonding device
JPH03135042A (en) * 1989-10-20 1991-06-10 Nippon Steel Corp Bonding of bonding wire and coating apparatus used therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538014A (en) * 1978-09-08 1980-03-17 Tdk Corp Wire bonding device
JPH03135042A (en) * 1989-10-20 1991-06-10 Nippon Steel Corp Bonding of bonding wire and coating apparatus used therefor

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