JPS51114868A - Position alignment equipment - Google Patents

Position alignment equipment

Info

Publication number
JPS51114868A
JPS51114868A JP50039103A JP3910375A JPS51114868A JP S51114868 A JPS51114868 A JP S51114868A JP 50039103 A JP50039103 A JP 50039103A JP 3910375 A JP3910375 A JP 3910375A JP S51114868 A JPS51114868 A JP S51114868A
Authority
JP
Japan
Prior art keywords
position alignment
alignment equipment
equipment
automate
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50039103A
Other languages
Japanese (ja)
Inventor
Isamu Yamazaki
Michio Tanimoto
Nobumasa Ogino
Yuzo Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50039103A priority Critical patent/JPS51114868A/en
Publication of JPS51114868A publication Critical patent/JPS51114868A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

Landscapes

  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

PURPOSE: Automate the correction of positions of pellets, etc., inclusive of position detection in the wire bonding process.
COPYRIGHT: (C)1976,JPO&Japio
JP50039103A 1975-04-02 1975-04-02 Position alignment equipment Pending JPS51114868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50039103A JPS51114868A (en) 1975-04-02 1975-04-02 Position alignment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50039103A JPS51114868A (en) 1975-04-02 1975-04-02 Position alignment equipment

Publications (1)

Publication Number Publication Date
JPS51114868A true JPS51114868A (en) 1976-10-08

Family

ID=12543723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50039103A Pending JPS51114868A (en) 1975-04-02 1975-04-02 Position alignment equipment

Country Status (1)

Country Link
JP (1) JPS51114868A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196056A (en) * 1987-02-10 1988-08-15 Mitsubishi Electric Corp Device for assembling semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196056A (en) * 1987-02-10 1988-08-15 Mitsubishi Electric Corp Device for assembling semiconductor

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