JPS51115540A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS51115540A
JPS51115540A JP2671275A JP2671275A JPS51115540A JP S51115540 A JPS51115540 A JP S51115540A JP 2671275 A JP2671275 A JP 2671275A JP 2671275 A JP2671275 A JP 2671275A JP S51115540 A JPS51115540 A JP S51115540A
Authority
JP
Japan
Prior art keywords
bonding method
electric
contact
making
combination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2671275A
Other languages
Japanese (ja)
Inventor
Yoshio Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP2671275A priority Critical patent/JPS51115540A/en
Publication of JPS51115540A publication Critical patent/JPS51115540A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE: Electric bonding method using anisotropically conducting adhesives, which is characterized in applying ultrasonic energy, in combination with electric current, in bonding process, thereby making the contact of the conducting adhesive grains with one another from point- to surface-contact to improve reliability of electric conduct ance.
COPYRIGHT: (C)1976,JPO&Japio
JP2671275A 1975-03-04 1975-03-04 Bonding method Pending JPS51115540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2671275A JPS51115540A (en) 1975-03-04 1975-03-04 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2671275A JPS51115540A (en) 1975-03-04 1975-03-04 Bonding method

Publications (1)

Publication Number Publication Date
JPS51115540A true JPS51115540A (en) 1976-10-12

Family

ID=12200960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2671275A Pending JPS51115540A (en) 1975-03-04 1975-03-04 Bonding method

Country Status (1)

Country Link
JP (1) JPS51115540A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208002A (en) * 1981-06-18 1982-12-21 Shinetsu Polymer Co Thermal pressure conductive composition
JPS61501924A (en) * 1984-04-19 1986-09-04 アンプ　インコ−ポレ−テツド Anisotropic conductive adhesive composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208002A (en) * 1981-06-18 1982-12-21 Shinetsu Polymer Co Thermal pressure conductive composition
JPS61501924A (en) * 1984-04-19 1986-09-04 アンプ　インコ−ポレ−テツド Anisotropic conductive adhesive composition

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