JPS51117870A - Wafer cracking method - Google Patents

Wafer cracking method

Info

Publication number
JPS51117870A
JPS51117870A JP4307975A JP4307975A JPS51117870A JP S51117870 A JPS51117870 A JP S51117870A JP 4307975 A JP4307975 A JP 4307975A JP 4307975 A JP4307975 A JP 4307975A JP S51117870 A JPS51117870 A JP S51117870A
Authority
JP
Japan
Prior art keywords
cracking method
wafer cracking
wafer
scribing
synchronizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4307975A
Other languages
Japanese (ja)
Inventor
Nobuo Hashizume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP4307975A priority Critical patent/JPS51117870A/en
Publication of JPS51117870A publication Critical patent/JPS51117870A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: By synchronizing the cracking operation with the pitch of scribing using a roller and a plate stick, the generation of reject chips is prevented.
COPYRIGHT: (C)1976,JPO&Japio
JP4307975A 1975-04-09 1975-04-09 Wafer cracking method Pending JPS51117870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4307975A JPS51117870A (en) 1975-04-09 1975-04-09 Wafer cracking method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4307975A JPS51117870A (en) 1975-04-09 1975-04-09 Wafer cracking method

Publications (1)

Publication Number Publication Date
JPS51117870A true JPS51117870A (en) 1976-10-16

Family

ID=12653826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4307975A Pending JPS51117870A (en) 1975-04-09 1975-04-09 Wafer cracking method

Country Status (1)

Country Link
JP (1) JPS51117870A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03109341U (en) * 1990-02-23 1991-11-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03109341U (en) * 1990-02-23 1991-11-11

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