JPS51139775A - Method of forming projection electrode - Google Patents

Method of forming projection electrode

Info

Publication number
JPS51139775A
JPS51139775A JP50064475A JP6447575A JPS51139775A JP S51139775 A JPS51139775 A JP S51139775A JP 50064475 A JP50064475 A JP 50064475A JP 6447575 A JP6447575 A JP 6447575A JP S51139775 A JPS51139775 A JP S51139775A
Authority
JP
Japan
Prior art keywords
projection electrode
forming projection
forming
electrode
evapolation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50064475A
Other languages
Japanese (ja)
Inventor
Koichi Oguchi
Keiichi Inouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP50064475A priority Critical patent/JPS51139775A/en
Publication of JPS51139775A publication Critical patent/JPS51139775A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To attain the cost down of a lip chip by forming a projection electrode more simply as compared with a method of vacuum evapolation.
COPYRIGHT: (C)1976,JPO&Japio
JP50064475A 1975-05-28 1975-05-28 Method of forming projection electrode Pending JPS51139775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50064475A JPS51139775A (en) 1975-05-28 1975-05-28 Method of forming projection electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50064475A JPS51139775A (en) 1975-05-28 1975-05-28 Method of forming projection electrode

Publications (1)

Publication Number Publication Date
JPS51139775A true JPS51139775A (en) 1976-12-02

Family

ID=13259281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50064475A Pending JPS51139775A (en) 1975-05-28 1975-05-28 Method of forming projection electrode

Country Status (1)

Country Link
JP (1) JPS51139775A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236476U (en) * 1988-08-31 1990-03-09
JPH07321438A (en) * 1995-04-10 1995-12-08 Sony Corp Printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236476U (en) * 1988-08-31 1990-03-09
JPH07321438A (en) * 1995-04-10 1995-12-08 Sony Corp Printed circuit board

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