JPS51135938A - Anisotropic electroconductive adhesive - Google Patents
Anisotropic electroconductive adhesiveInfo
- Publication number
- JPS51135938A JPS51135938A JP50060449A JP6044975A JPS51135938A JP S51135938 A JPS51135938 A JP S51135938A JP 50060449 A JP50060449 A JP 50060449A JP 6044975 A JP6044975 A JP 6044975A JP S51135938 A JPS51135938 A JP S51135938A
- Authority
- JP
- Japan
- Prior art keywords
- electroconductive adhesive
- anisotropic electroconductive
- anisotropic
- low cost
- containing metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/321—Structures or relative sizes of die-attach connectors
- H10W72/325—Die-attach connectors having a filler embedded in a matrix
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
Landscapes
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
PURPOSE: A low cost anisotropic electroconductive adhesive containing metal plated particles as improved electroconductive fillers.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50060449A JPS51135938A (en) | 1975-05-21 | 1975-05-21 | Anisotropic electroconductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50060449A JPS51135938A (en) | 1975-05-21 | 1975-05-21 | Anisotropic electroconductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51135938A true JPS51135938A (en) | 1976-11-25 |
Family
ID=13142582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50060449A Pending JPS51135938A (en) | 1975-05-21 | 1975-05-21 | Anisotropic electroconductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51135938A (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242253A (en) * | 1975-09-30 | 1977-04-01 | Seikosha Kk | Method of connecting terminal groups |
| JPS55774A (en) * | 1979-05-01 | 1980-01-07 | Seikosha Co Ltd | Electrically conductive adhesive part and its use |
| JPS57154897A (en) * | 1980-12-22 | 1982-09-24 | Chomerics Inc | Electromagnetic shield |
| JPS58182685A (en) * | 1982-04-20 | 1983-10-25 | セイコーエプソン株式会社 | Vertical energization agent for display panel |
| JPS619472A (en) * | 1984-06-22 | 1986-01-17 | Seikosha Co Ltd | Adhesive having anisotropic electrical conductivity |
| JPS6177279A (en) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | Connection member for circuit |
| JPS625481U (en) * | 1985-06-21 | 1987-01-13 | ||
| JPS6258508A (en) * | 1985-09-09 | 1987-03-14 | 富士高分子工業株式会社 | organic conductor |
| JPS62176139A (en) * | 1986-01-29 | 1987-08-01 | Fuji Xerox Co Ltd | Anisotropic conducting material and packaging method for semiconductor device using said material |
| JPS62177082A (en) * | 1986-01-30 | 1987-08-03 | Toray Ind Inc | Anisotropic electrically conductive adhesive |
| JPS62243668A (en) * | 1986-04-16 | 1987-10-24 | Matsushita Electric Ind Co Ltd | Antisotropic electrically conductive adhesive |
| JPS6354737A (en) * | 1986-08-25 | 1988-03-09 | Nec Corp | Method of packaging integrated circuit chip |
| JPS63301407A (en) * | 1987-05-29 | 1988-12-08 | Hitachi Chem Co Ltd | Connecting material for circuit |
| JPH09218419A (en) * | 1997-01-17 | 1997-08-19 | Seiko Epson Corp | Display panel |
| WO2006093315A1 (en) * | 2005-03-04 | 2006-09-08 | Sony Chemical & Information Device Corporation | Anisotropic conductive adhesive and method of electrode connection therewith |
| US7507777B2 (en) | 2005-06-03 | 2009-03-24 | Shin-Etsu Chemical Co., Ltd. | Press-bonding anisotropic conductive resin composition and elastomeric anisotropic conductor |
| WO2025094733A1 (en) * | 2023-11-02 | 2025-05-08 | 株式会社豊田自動織機 | Power storage device |
-
1975
- 1975-05-21 JP JP50060449A patent/JPS51135938A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242253A (en) * | 1975-09-30 | 1977-04-01 | Seikosha Kk | Method of connecting terminal groups |
| JPS55774A (en) * | 1979-05-01 | 1980-01-07 | Seikosha Co Ltd | Electrically conductive adhesive part and its use |
| JPS57154897A (en) * | 1980-12-22 | 1982-09-24 | Chomerics Inc | Electromagnetic shield |
| JPS58182685A (en) * | 1982-04-20 | 1983-10-25 | セイコーエプソン株式会社 | Vertical energization agent for display panel |
| JPS619472A (en) * | 1984-06-22 | 1986-01-17 | Seikosha Co Ltd | Adhesive having anisotropic electrical conductivity |
| JPS6177279A (en) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | Connection member for circuit |
| JPS625481U (en) * | 1985-06-21 | 1987-01-13 | ||
| JPS6258508A (en) * | 1985-09-09 | 1987-03-14 | 富士高分子工業株式会社 | organic conductor |
| JPS62176139A (en) * | 1986-01-29 | 1987-08-01 | Fuji Xerox Co Ltd | Anisotropic conducting material and packaging method for semiconductor device using said material |
| JPS62177082A (en) * | 1986-01-30 | 1987-08-03 | Toray Ind Inc | Anisotropic electrically conductive adhesive |
| JPS62243668A (en) * | 1986-04-16 | 1987-10-24 | Matsushita Electric Ind Co Ltd | Antisotropic electrically conductive adhesive |
| JPS6354737A (en) * | 1986-08-25 | 1988-03-09 | Nec Corp | Method of packaging integrated circuit chip |
| JPS63301407A (en) * | 1987-05-29 | 1988-12-08 | Hitachi Chem Co Ltd | Connecting material for circuit |
| JPH09218419A (en) * | 1997-01-17 | 1997-08-19 | Seiko Epson Corp | Display panel |
| WO2006093315A1 (en) * | 2005-03-04 | 2006-09-08 | Sony Chemical & Information Device Corporation | Anisotropic conductive adhesive and method of electrode connection therewith |
| JP4891895B2 (en) * | 2005-03-04 | 2012-03-07 | ソニーケミカル&インフォメーションデバイス株式会社 | Anisotropic conductive adhesive and electrode connection method using the same |
| US7507777B2 (en) | 2005-06-03 | 2009-03-24 | Shin-Etsu Chemical Co., Ltd. | Press-bonding anisotropic conductive resin composition and elastomeric anisotropic conductor |
| WO2025094733A1 (en) * | 2023-11-02 | 2025-05-08 | 株式会社豊田自動織機 | Power storage device |
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