JPS51137376A - Manufacturing method for plastic seal type semi conductor - Google Patents

Manufacturing method for plastic seal type semi conductor

Info

Publication number
JPS51137376A
JPS51137376A JP6165575A JP6165575A JPS51137376A JP S51137376 A JPS51137376 A JP S51137376A JP 6165575 A JP6165575 A JP 6165575A JP 6165575 A JP6165575 A JP 6165575A JP S51137376 A JPS51137376 A JP S51137376A
Authority
JP
Japan
Prior art keywords
manufacturing
seal type
type semi
plastic seal
semi conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6165575A
Other languages
Japanese (ja)
Inventor
Hideyuki Irie
Tetsuji Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6165575A priority Critical patent/JPS51137376A/en
Publication of JPS51137376A publication Critical patent/JPS51137376A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:A manufacturing method for a plastic seal type semi conductor device of which gate residual after molding does not give adverse effect.
JP6165575A 1975-05-22 1975-05-22 Manufacturing method for plastic seal type semi conductor Pending JPS51137376A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6165575A JPS51137376A (en) 1975-05-22 1975-05-22 Manufacturing method for plastic seal type semi conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6165575A JPS51137376A (en) 1975-05-22 1975-05-22 Manufacturing method for plastic seal type semi conductor

Publications (1)

Publication Number Publication Date
JPS51137376A true JPS51137376A (en) 1976-11-27

Family

ID=13177446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6165575A Pending JPS51137376A (en) 1975-05-22 1975-05-22 Manufacturing method for plastic seal type semi conductor

Country Status (1)

Country Link
JP (1) JPS51137376A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5778641U (en) * 1980-10-30 1982-05-15
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
JPH01157539A (en) * 1988-11-08 1989-06-20 Yamada Seisakusho:Kk Metal mold for transfer molding for resin sealing of lead frame
JPH01156554U (en) * 1988-04-19 1989-10-27

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5778641U (en) * 1980-10-30 1982-05-15
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
JPH01156554U (en) * 1988-04-19 1989-10-27
JPH01157539A (en) * 1988-11-08 1989-06-20 Yamada Seisakusho:Kk Metal mold for transfer molding for resin sealing of lead frame

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