JPS51138164A - Production method of package for semiconductor circuit element - Google Patents

Production method of package for semiconductor circuit element

Info

Publication number
JPS51138164A
JPS51138164A JP6184075A JP6184075A JPS51138164A JP S51138164 A JPS51138164 A JP S51138164A JP 6184075 A JP6184075 A JP 6184075A JP 6184075 A JP6184075 A JP 6184075A JP S51138164 A JPS51138164 A JP S51138164A
Authority
JP
Japan
Prior art keywords
package
production method
circuit element
semiconductor circuit
dissiparation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6184075A
Other languages
Japanese (ja)
Other versions
JPS5716742B2 (en
Inventor
Eiji Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6184075A priority Critical patent/JPS51138164A/en
Publication of JPS51138164A publication Critical patent/JPS51138164A/en
Publication of JPS5716742B2 publication Critical patent/JPS5716742B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To improve heat dissiparation characteristic and pattern precision by using metal containing glass as the mother glass.
COPYRIGHT: (C)1976,JPO&Japio
JP6184075A 1975-05-26 1975-05-26 Production method of package for semiconductor circuit element Granted JPS51138164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6184075A JPS51138164A (en) 1975-05-26 1975-05-26 Production method of package for semiconductor circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6184075A JPS51138164A (en) 1975-05-26 1975-05-26 Production method of package for semiconductor circuit element

Publications (2)

Publication Number Publication Date
JPS51138164A true JPS51138164A (en) 1976-11-29
JPS5716742B2 JPS5716742B2 (en) 1982-04-07

Family

ID=13182680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6184075A Granted JPS51138164A (en) 1975-05-26 1975-05-26 Production method of package for semiconductor circuit element

Country Status (1)

Country Link
JP (1) JPS51138164A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946050A (en) * 1982-09-09 1984-03-15 Narumi China Corp Ceramic package for semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946050A (en) * 1982-09-09 1984-03-15 Narumi China Corp Ceramic package for semiconductor

Also Published As

Publication number Publication date
JPS5716742B2 (en) 1982-04-07

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