JPS51144182A - Indirectly heated semiconductor unit - Google Patents
Indirectly heated semiconductor unitInfo
- Publication number
- JPS51144182A JPS51144182A JP50068409A JP6840975A JPS51144182A JP S51144182 A JPS51144182 A JP S51144182A JP 50068409 A JP50068409 A JP 50068409A JP 6840975 A JP6840975 A JP 6840975A JP S51144182 A JPS51144182 A JP S51144182A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor unit
- indirectly heated
- heated semiconductor
- package
- electric heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: In directly heated semiconductor unit with high heat response and reliability achieved by improving insulation between electric heater and package.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50068409A JPS51144182A (en) | 1975-06-05 | 1975-06-05 | Indirectly heated semiconductor unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50068409A JPS51144182A (en) | 1975-06-05 | 1975-06-05 | Indirectly heated semiconductor unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51144182A true JPS51144182A (en) | 1976-12-10 |
Family
ID=13372839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50068409A Pending JPS51144182A (en) | 1975-06-05 | 1975-06-05 | Indirectly heated semiconductor unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51144182A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5374368A (en) * | 1976-12-15 | 1978-07-01 | Hitachi Ltd | Package for semiconductor device |
| JPS5922392A (en) * | 1982-07-06 | 1984-02-04 | スペリ・コ−ポレ−シヨン | Integrated circuit package with integrated heating circuit, method of producing same and method of soldering by reflow of same |
| JPS5972750A (en) * | 1982-10-19 | 1984-04-24 | Matsushita Electric Ind Co Ltd | Semiconductor package and manufacture of semiconductor device |
| JPS59136968A (en) * | 1983-01-25 | 1984-08-06 | Mitsubishi Electric Corp | Hybrid integrated circuit device |
| JPS63126252A (en) * | 1987-06-12 | 1988-05-30 | Hitachi Ltd | Manufacture of ultraviolet-erasable programmable romic |
| JP2010021530A (en) * | 2008-07-14 | 2010-01-28 | Honeywell Internatl Inc | Packaged die heater |
| JP2014143360A (en) * | 2013-01-25 | 2014-08-07 | Kyocera Corp | Electronic component mounting board |
| WO2015008860A1 (en) * | 2013-07-19 | 2015-01-22 | 日本電信電話株式会社 | Package for electrical element |
-
1975
- 1975-06-05 JP JP50068409A patent/JPS51144182A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5374368A (en) * | 1976-12-15 | 1978-07-01 | Hitachi Ltd | Package for semiconductor device |
| JPS5922392A (en) * | 1982-07-06 | 1984-02-04 | スペリ・コ−ポレ−シヨン | Integrated circuit package with integrated heating circuit, method of producing same and method of soldering by reflow of same |
| JPS5972750A (en) * | 1982-10-19 | 1984-04-24 | Matsushita Electric Ind Co Ltd | Semiconductor package and manufacture of semiconductor device |
| JPS59136968A (en) * | 1983-01-25 | 1984-08-06 | Mitsubishi Electric Corp | Hybrid integrated circuit device |
| JPS63126252A (en) * | 1987-06-12 | 1988-05-30 | Hitachi Ltd | Manufacture of ultraviolet-erasable programmable romic |
| JP2010021530A (en) * | 2008-07-14 | 2010-01-28 | Honeywell Internatl Inc | Packaged die heater |
| JP2014143360A (en) * | 2013-01-25 | 2014-08-07 | Kyocera Corp | Electronic component mounting board |
| WO2015008860A1 (en) * | 2013-07-19 | 2015-01-22 | 日本電信電話株式会社 | Package for electrical element |
| JP2015023154A (en) * | 2013-07-19 | 2015-02-02 | 日本電信電話株式会社 | Package of electric element |
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