JPS51138165A - Package stracture for thermal resistance and shield - Google Patents

Package stracture for thermal resistance and shield

Info

Publication number
JPS51138165A
JPS51138165A JP50062373A JP6237375A JPS51138165A JP S51138165 A JPS51138165 A JP S51138165A JP 50062373 A JP50062373 A JP 50062373A JP 6237375 A JP6237375 A JP 6237375A JP S51138165 A JPS51138165 A JP S51138165A
Authority
JP
Japan
Prior art keywords
package
thermal resistance
stracture
shield
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50062373A
Other languages
Japanese (ja)
Inventor
Hiroichi Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50062373A priority Critical patent/JPS51138165A/en
Publication of JPS51138165A publication Critical patent/JPS51138165A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve heat radiation effect and shielding effect by distributing the conductor electrodes with low thermal resistance and low electric resistance connected to the terminals of conductor pellet in upper or lower part of the semiconductor pellet located at a part of package or whole package.
COPYRIGHT: (C)1976,JPO&Japio
JP50062373A 1975-05-23 1975-05-23 Package stracture for thermal resistance and shield Pending JPS51138165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50062373A JPS51138165A (en) 1975-05-23 1975-05-23 Package stracture for thermal resistance and shield

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50062373A JPS51138165A (en) 1975-05-23 1975-05-23 Package stracture for thermal resistance and shield

Publications (1)

Publication Number Publication Date
JPS51138165A true JPS51138165A (en) 1976-11-29

Family

ID=13198240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50062373A Pending JPS51138165A (en) 1975-05-23 1975-05-23 Package stracture for thermal resistance and shield

Country Status (1)

Country Link
JP (1) JPS51138165A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122759A (en) * 1982-01-14 1983-07-21 Fujitsu Ltd Semiconductor device
JPS58108807U (en) * 1982-01-15 1983-07-25 松下電工株式会社 Sphygmomanometer
JPS60501335A (en) * 1983-05-18 1985-08-15 ミント−パック・テクノロジイス・インコ−ポレ−テッド Integrated circuit module and its manufacturing method
JPS63318764A (en) * 1987-06-22 1988-12-27 Shinko Electric Ind Co Ltd Semiconductor device for high frequency and lead frame for said device
JPH04312963A (en) * 1991-02-21 1992-11-04 Mitsui Petrochem Ind Ltd Semiconductor device improved for moisture resistance and manufacture thereof
US6048754A (en) * 1990-07-21 2000-04-11 Mitsui Chemicals, Inc. Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122759A (en) * 1982-01-14 1983-07-21 Fujitsu Ltd Semiconductor device
JPS58108807U (en) * 1982-01-15 1983-07-25 松下電工株式会社 Sphygmomanometer
JPS60501335A (en) * 1983-05-18 1985-08-15 ミント−パック・テクノロジイス・インコ−ポレ−テッド Integrated circuit module and its manufacturing method
JPS63318764A (en) * 1987-06-22 1988-12-27 Shinko Electric Ind Co Ltd Semiconductor device for high frequency and lead frame for said device
US6048754A (en) * 1990-07-21 2000-04-11 Mitsui Chemicals, Inc. Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package
JPH04312963A (en) * 1991-02-21 1992-11-04 Mitsui Petrochem Ind Ltd Semiconductor device improved for moisture resistance and manufacture thereof

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