JPS51148359A - Lead formation method of resin mold ic element - Google Patents

Lead formation method of resin mold ic element

Info

Publication number
JPS51148359A
JPS51148359A JP7194075A JP7194075A JPS51148359A JP S51148359 A JPS51148359 A JP S51148359A JP 7194075 A JP7194075 A JP 7194075A JP 7194075 A JP7194075 A JP 7194075A JP S51148359 A JPS51148359 A JP S51148359A
Authority
JP
Japan
Prior art keywords
formation method
resin mold
lead
lead formation
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7194075A
Other languages
Japanese (ja)
Inventor
Ryoji Iwamura
Michiharu Honda
Kenichi Okada
Keizo Otsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7194075A priority Critical patent/JPS51148359A/en
Publication of JPS51148359A publication Critical patent/JPS51148359A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To enable the parallel lead formation in one part of the lead part by enlarging the bent puch angle of a mold and bending a lead by two steps using this bend punch.
COPYRIGHT: (C)1976,JPO&Japio
JP7194075A 1975-06-16 1975-06-16 Lead formation method of resin mold ic element Pending JPS51148359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7194075A JPS51148359A (en) 1975-06-16 1975-06-16 Lead formation method of resin mold ic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7194075A JPS51148359A (en) 1975-06-16 1975-06-16 Lead formation method of resin mold ic element

Publications (1)

Publication Number Publication Date
JPS51148359A true JPS51148359A (en) 1976-12-20

Family

ID=13474998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7194075A Pending JPS51148359A (en) 1975-06-16 1975-06-16 Lead formation method of resin mold ic element

Country Status (1)

Country Link
JP (1) JPS51148359A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60181050U (en) * 1984-05-12 1985-12-02 新日本無線株式会社 semiconductor equipment
JPS6363410U (en) * 1986-10-15 1988-04-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60181050U (en) * 1984-05-12 1985-12-02 新日本無線株式会社 semiconductor equipment
JPS6363410U (en) * 1986-10-15 1988-04-26

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