JPS5287982A - Resin molding method of semiconductor elements - Google Patents

Resin molding method of semiconductor elements

Info

Publication number
JPS5287982A
JPS5287982A JP522776A JP522776A JPS5287982A JP S5287982 A JPS5287982 A JP S5287982A JP 522776 A JP522776 A JP 522776A JP 522776 A JP522776 A JP 522776A JP S5287982 A JPS5287982 A JP S5287982A
Authority
JP
Japan
Prior art keywords
molding method
semiconductor elements
resin molding
frame
opposedly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP522776A
Other languages
Japanese (ja)
Other versions
JPS5524694B2 (en
Inventor
Eiichi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP522776A priority Critical patent/JPS5287982A/en
Publication of JPS5287982A publication Critical patent/JPS5287982A/en
Publication of JPS5524694B2 publication Critical patent/JPS5524694B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent warpage of a frame by disposing the blanked side of the frame opposedly to a lower die and performing transfer molding.
COPYRIGHT: (C)1977,JPO&Japio
JP522776A 1976-01-17 1976-01-17 Resin molding method of semiconductor elements Granted JPS5287982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP522776A JPS5287982A (en) 1976-01-17 1976-01-17 Resin molding method of semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP522776A JPS5287982A (en) 1976-01-17 1976-01-17 Resin molding method of semiconductor elements

Publications (2)

Publication Number Publication Date
JPS5287982A true JPS5287982A (en) 1977-07-22
JPS5524694B2 JPS5524694B2 (en) 1980-07-01

Family

ID=11605288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP522776A Granted JPS5287982A (en) 1976-01-17 1976-01-17 Resin molding method of semiconductor elements

Country Status (1)

Country Link
JP (1) JPS5287982A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59150439A (en) * 1984-01-20 1984-08-28 Toshiba Corp Semiconductor device
US8863376B2 (en) 2008-10-30 2014-10-21 Fujitsu Limited Connector removing jig and connector removing method using the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7421892B2 (en) 2019-09-27 2024-01-25 株式会社マキタ battery pack

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59150439A (en) * 1984-01-20 1984-08-28 Toshiba Corp Semiconductor device
US8863376B2 (en) 2008-10-30 2014-10-21 Fujitsu Limited Connector removing jig and connector removing method using the same

Also Published As

Publication number Publication date
JPS5524694B2 (en) 1980-07-01

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