JPS51150276A - Package structure of ic - Google Patents

Package structure of ic

Info

Publication number
JPS51150276A
JPS51150276A JP50073860A JP7386075A JPS51150276A JP S51150276 A JPS51150276 A JP S51150276A JP 50073860 A JP50073860 A JP 50073860A JP 7386075 A JP7386075 A JP 7386075A JP S51150276 A JPS51150276 A JP S51150276A
Authority
JP
Japan
Prior art keywords
package structure
chips
permits
ease
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50073860A
Other languages
Japanese (ja)
Inventor
Yoshio Iinuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP50073860A priority Critical patent/JPS51150276A/en
Publication of JPS51150276A publication Critical patent/JPS51150276A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: A confidential wireless bonding method by which IC chips are bonded to a circuit substrate with ease and which permits a multiple pin bonding.
COPYRIGHT: (C)1976,JPO&Japio
JP50073860A 1975-06-18 1975-06-18 Package structure of ic Pending JPS51150276A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50073860A JPS51150276A (en) 1975-06-18 1975-06-18 Package structure of ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50073860A JPS51150276A (en) 1975-06-18 1975-06-18 Package structure of ic

Publications (1)

Publication Number Publication Date
JPS51150276A true JPS51150276A (en) 1976-12-23

Family

ID=13530330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50073860A Pending JPS51150276A (en) 1975-06-18 1975-06-18 Package structure of ic

Country Status (1)

Country Link
JP (1) JPS51150276A (en)

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