JPS522173A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS522173A
JPS522173A JP50077427A JP7742775A JPS522173A JP S522173 A JPS522173 A JP S522173A JP 50077427 A JP50077427 A JP 50077427A JP 7742775 A JP7742775 A JP 7742775A JP S522173 A JPS522173 A JP S522173A
Authority
JP
Japan
Prior art keywords
semiconductor integrated
integrated circuit
circuit substrate
circuit
steps required
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50077427A
Other languages
Japanese (ja)
Inventor
Hiroyuki Miyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP50077427A priority Critical patent/JPS522173A/en
Publication of JPS522173A publication Critical patent/JPS522173A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To provide rational and efficient mutual wiring between semiconductor integrated circuit and circuit substrate.by reducing steps required for charging semiconductor integrated circuit to circuit substrate.
COPYRIGHT: (C)1977,JPO&Japio
JP50077427A 1975-06-23 1975-06-23 Semiconductor integrated circuit Pending JPS522173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50077427A JPS522173A (en) 1975-06-23 1975-06-23 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50077427A JPS522173A (en) 1975-06-23 1975-06-23 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS522173A true JPS522173A (en) 1977-01-08

Family

ID=13633676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50077427A Pending JPS522173A (en) 1975-06-23 1975-06-23 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS522173A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571091A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Multilayer circuit board
JPS60224401A (en) * 1984-04-24 1985-11-08 太昭農工機株式会社 Bearing apparatus in intertillage weeder
JPS63180402U (en) * 1987-05-14 1988-11-22
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
US5355102A (en) * 1990-04-05 1994-10-11 General Electric Company HDI impedance matched microwave circuit assembly
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4996264A (en) * 1973-01-22 1974-09-12
JPS5013668B1 (en) * 1968-09-27 1975-05-21

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013668B1 (en) * 1968-09-27 1975-05-21
JPS4996264A (en) * 1973-01-22 1974-09-12

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571091A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Multilayer circuit board
JPS60224401A (en) * 1984-04-24 1985-11-08 太昭農工機株式会社 Bearing apparatus in intertillage weeder
JPS63180402U (en) * 1987-05-14 1988-11-22
US5355102A (en) * 1990-04-05 1994-10-11 General Electric Company HDI impedance matched microwave circuit assembly
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure

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