JPS5143675A - - Google Patents

Info

Publication number: JPS5143675A
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP50077134A

Other versions

JPS547677B2 (ja

Inventor

Esu Kaizaa Aran

Aaru Harisu Hyuu

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JEIDO CORP ZA

Original Assignee

JEIDO CORP ZA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-10-03

Filing date

1975-06-24

Publication date

1976-04-14

1975-06-24 Application filed by JEIDO CORP ZA filed Critical JEIDO CORP ZA

1976-04-14 Publication of JPS5143675A publication Critical patent/JPS5143675A/ja

1979-04-09 Publication of JPS547677B2 publication Critical patent/JPS547677B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/077—Connecting of TAB connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device

Landscapes

Wire Bonding (AREA)

JP7713475A 1974-10-03 1975-06-24 Expired JPS547677B2 (ja)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US05/511,835 US3949925A (en)	1974-10-03	1974-10-03	Outer lead bonder

Publications (2)

Publication Number	Publication Date
JPS5143675A true JPS5143675A (ja)	1976-04-14
JPS547677B2 JPS547677B2 (ja)	1979-04-09

Family

ID=24036648

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP7713475A Expired JPS547677B2 (ja)	1974-10-03	1975-06-24

Country Status (2)

Country	Link
US (1)	US3949925A (ja)
JP (1)	JPS547677B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02205331A (ja) *	1989-02-03	1990-08-15	Toray Eng Co Ltd	半導体のボンディング方法
JPH06168983A (ja) *	1992-04-03	1994-06-14	Shibuya Kogyo Co Ltd	ボンディングマシーンのチップステージｚ軸駆動機構

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4050618A (en) *	1975-06-19	1977-09-27	Angelucci Sr Thomas L	Flexible lead bonding apparatus
US4099660A (en) *	1975-10-31	1978-07-11	National Semiconductor Corporation	Apparatus for and method of shaping interconnect leads
US4166562A (en) *	1977-09-01	1979-09-04	The Jade Corporation	Assembly system for microcomponent devices such as semiconductor devices
US4255851A (en) *	1978-12-06	1981-03-17	Western Electric Company, Inc.	Method and apparatus for indelibly marking articles during a manufacturing process
FR2495836A1 (fr) *	1980-12-05	1982-06-11	Cii Honeywell Bull	Machine automatique de cambrage des pattes de connexion de plaquettes de circuits integres
US4407440A (en) *	1981-02-23	1983-10-04	Mesa Technology	Semiconductor die bonding machine
JPS5850572A (ja) *	1981-09-22	1983-03-25	株式会社東芝	デイスプレイ装置の製造方法
JPS5851530A (ja) *	1981-09-22	1983-03-26	Toshiba Corp	半導体ペレツト配列装置および方法
US4876791A (en) *	1986-04-22	1989-10-31	Kulicke & Soffa Industries, Inc.	Apparatus for and methods of die bonding
US4765531A (en) *	1987-05-14	1988-08-23	Kulicke And Soffa Industries Inc.	Quick change work station apparatus for automatic wire bonders
US5059559A (en) *	1987-11-02	1991-10-22	Hitachi, Ltd.	Method of aligning and bonding tab inner leads
US5339939A (en) *	1992-08-31	1994-08-23	Cna Manufacturing Systems, Inc.	Pocket tape feeder system
JP3178181B2 (ja) *	1993-09-06	2001-06-18	松下電器産業株式会社	アウターリードボンディング装置およびアウターリードボンディング方法
BE1007866A3 (nl) *	1993-12-10	1995-11-07	Koninkl Philips Electronics Nv	Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager.
JP3079501B2 (ja) *	1995-06-26	2000-08-21	株式会社新川	ダイ突き上げ装置の調整装置
JP3089392B2 (ja) *	1995-07-13	2000-09-18	株式会社新川	ボンデイング装置
US5971256A (en) *	1997-02-05	1999-10-26	Micron Technology, Inc.	Quick change precisor
EP0949662A3 (en) *	1998-03-27	2001-08-01	Supersensor (Proprietary) Limited	Die transfer method and system
FR2926890B1 (fr) *	2008-01-30	2011-01-07	St Microelectronics Grenoble	Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques
DE102008018886A1 (de) *	2008-04-14	2009-10-15	Marquardt Gmbh	Bauelement und Verfahren zu dessen Herstellung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4890475A (ja) *	1972-02-14	1973-11-26

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3544857A (en) *	1966-08-16	1970-12-01	Signetics Corp	Integrated circuit assembly with lead structure and method
US3689991A (en) *	1968-03-01	1972-09-12	Gen Electric	A method of manufacturing a semiconductor device utilizing a flexible carrier
US3698073A (en) *	1970-10-13	1972-10-17	Motorola Inc	Contact bonding and packaging of integrated circuits
US3724068A (en) *	1971-02-25	1973-04-03	Du Pont	Semiconductor chip packaging apparatus and method
US3793714A (en) *	1971-05-27	1974-02-26	Texas Instruments Inc	Integrated circuit assembly using etched metal patterns of flexible insulating film
US3859718A (en) *	1973-01-02	1975-01-14	Texas Instruments Inc	Method and apparatus for the assembly of semiconductor devices

1974
- 1974-10-03 US US05/511,835 patent/US3949925A/en not_active Expired - Lifetime
1975
- 1975-06-24 JP JP7713475A patent/JPS547677B2/ja not_active Expired

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4890475A (ja) *	1972-02-14	1973-11-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02205331A (ja) *	1989-02-03	1990-08-15	Toray Eng Co Ltd	半導体のボンディング方法
JPH06168983A (ja) *	1992-04-03	1994-06-14	Shibuya Kogyo Co Ltd	ボンディングマシーンのチップステージｚ軸駆動機構

Also Published As

Publication number	Publication date
JPS547677B2 (ja)	1979-04-09
US3949925A (en)	1976-04-13

Publication	Publication Date	Title
JPS547677B2 (ja)	1979-04-09
DK64575A (ja)	1975-10-20
DK140273C (ja)	1979-12-17
FI751183A7 (ja)	1975-10-26
AU7459074A (ja)	1976-04-29
AU7462274A (ja)	1976-04-29
DE2436626A1 (ja)	1975-06-05
AU6599874A (ja)	1975-08-28
FI753167A7 (ja)	1976-05-21
DD113135A1 (ja)	1975-05-12
BG19927A1 (ja)	1975-10-30
BG19764A1 (ja)	1975-10-10
CH612423A5 (ja)	1979-07-31
BG19564A1 (ja)	1975-06-25
CH606009A5 (ja)	1978-10-13
BG19548A2 (ja)	1975-06-25
CH597652A5 (ja)	1978-04-14
CH595080A5 (ja)	1978-01-31
BE830261A (ja)	1975-12-16
CH595007A5 (ja)	1978-01-31
CH591263A5 (ja)	1977-09-15
CH580532A5 (ja)	1976-10-15
CH579264A5 (ja)	1976-08-31
BE829576A (ja)	1975-11-28
AU7504272A (ja)	1975-02-13

JPS5143675A - - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (1)

Publications (2)

Family

ID=24036648

Family Applications (1)

Country Status (2)

Cited By (2)

Families Citing this family (20)

Citations (1)

Family Cites Families (6)

Patent Citations (1)

Cited By (2)

Also Published As

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