JPS516515B1 - - Google Patents

Info

Publication number
JPS516515B1
JPS516515B1 JP47031247A JP3124772A JPS516515B1 JP S516515 B1 JPS516515 B1 JP S516515B1 JP 47031247 A JP47031247 A JP 47031247A JP 3124772 A JP3124772 A JP 3124772A JP S516515 B1 JPS516515 B1 JP S516515B1
Authority
JP
Japan
Prior art keywords
cross
cross under
region
hermetic seal
seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47031247A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS516515B1 publication Critical patent/JPS516515B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP47031247A 1971-04-01 1972-03-30 Pending JPS516515B1 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13033971A 1971-04-01 1971-04-01

Publications (1)

Publication Number Publication Date
JPS516515B1 true JPS516515B1 (2) 1976-02-28

Family

ID=22444221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47031247A Pending JPS516515B1 (2) 1971-04-01 1972-03-30

Country Status (2)

Country Link
US (1) US3748543A (2)
JP (1) JPS516515B1 (2)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548700B2 (2) * 1973-01-30 1980-12-08
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device
WO1982002458A1 (en) * 1981-01-15 1982-07-22 Link Joseph Integrated circuit package
FR2527837A1 (fr) * 1982-05-25 1983-12-02 Thomson Csf Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication
US5381037A (en) * 1993-06-03 1995-01-10 Advanced Micro Devices, Inc. Lead frame with selected inner leads coupled to an inner frame member for an integrated circuit package assemblies
EP1213754A3 (en) * 1994-03-18 2005-05-25 Hitachi Chemical Co., Ltd. Fabrication process of semiconductor package and semiconductor package
CN1306538C (zh) * 2001-04-23 2007-03-21 株式会社东芝 图像显示器件及其制造方法和制造装置
US7836586B2 (en) * 2008-08-21 2010-11-23 National Semiconductor Corporation Thin foil semiconductor package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158788A (en) * 1960-08-15 1964-11-24 Fairchild Camera Instr Co Solid-state circuitry having discrete regions of semi-conductor material isolated by an insulating material
US3189973A (en) * 1961-11-27 1965-06-22 Bell Telephone Labor Inc Method of fabricating a semiconductor device
DE1249466B (2) * 1963-10-29 1900-01-01
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3489956A (en) * 1966-09-30 1970-01-13 Nippon Electric Co Semiconductor device container

Also Published As

Publication number Publication date
US3748543A (en) 1973-07-24

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