JPS5318962A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS5318962A
JPS5318962A JP9385976A JP9385976A JPS5318962A JP S5318962 A JPS5318962 A JP S5318962A JP 9385976 A JP9385976 A JP 9385976A JP 9385976 A JP9385976 A JP 9385976A JP S5318962 A JPS5318962 A JP S5318962A
Authority
JP
Japan
Prior art keywords
semiconductor package
substrate
metallized
brazing
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9385976A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9385976A priority Critical patent/JPS5318962A/en
Publication of JPS5318962A publication Critical patent/JPS5318962A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To lower the electric resistance of metallized layers by leading out one of metallized patterns to the back of an insulation substrate through a through-hole and brazing said pattern to the external lead extended up to there on the back of the substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP9385976A 1976-08-05 1976-08-05 Semiconductor package Pending JPS5318962A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9385976A JPS5318962A (en) 1976-08-05 1976-08-05 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9385976A JPS5318962A (en) 1976-08-05 1976-08-05 Semiconductor package

Publications (1)

Publication Number Publication Date
JPS5318962A true JPS5318962A (en) 1978-02-21

Family

ID=14094150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9385976A Pending JPS5318962A (en) 1976-08-05 1976-08-05 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS5318962A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822741U (en) * 1981-08-07 1983-02-12 京セラ株式会社 semiconductor package
JPS5881951U (en) * 1981-11-27 1983-06-03 日本特殊陶業株式会社 Package for mounting semiconductor elements
JPH0312953A (en) * 1989-06-12 1991-01-21 Nec Corp Semiconductor container

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822741U (en) * 1981-08-07 1983-02-12 京セラ株式会社 semiconductor package
JPS5881951U (en) * 1981-11-27 1983-06-03 日本特殊陶業株式会社 Package for mounting semiconductor elements
JPH0312953A (en) * 1989-06-12 1991-01-21 Nec Corp Semiconductor container

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