JPS52114435A - Dipping type tin plating device - Google Patents

Dipping type tin plating device

Info

Publication number
JPS52114435A
JPS52114435A JP2814777A JP2814777A JPS52114435A JP S52114435 A JPS52114435 A JP S52114435A JP 2814777 A JP2814777 A JP 2814777A JP 2814777 A JP2814777 A JP 2814777A JP S52114435 A JPS52114435 A JP S52114435A
Authority
JP
Japan
Prior art keywords
tin plating
plating device
type tin
dipping type
dipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2814777A
Other languages
English (en)
Japanese (ja)
Inventor
Pieeru Riooru Jiyan
Berutongen Berunaaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS52114435A publication Critical patent/JPS52114435A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
JP2814777A 1976-03-19 1977-03-16 Dipping type tin plating device Pending JPS52114435A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7608011A FR2344641A1 (fr) 1976-03-19 1976-03-19 Dispositif d'etamage au trempe

Publications (1)

Publication Number Publication Date
JPS52114435A true JPS52114435A (en) 1977-09-26

Family

ID=9170684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2814777A Pending JPS52114435A (en) 1976-03-19 1977-03-16 Dipping type tin plating device

Country Status (7)

Country Link
JP (1) JPS52114435A (de)
AT (1) AT349283B (de)
DE (1) DE2709788A1 (de)
FR (1) FR2344641A1 (de)
GB (1) GB1567397A (de)
NL (1) NL7702703A (de)
SE (1) SE7702996L (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
DE3339887A1 (de) * 1983-11-04 1985-05-15 Klaus 6107 Reinheim Obermann Vorrichtung zum verzinnen von leiterplatten
GB2250673A (en) * 1990-12-13 1992-06-17 Peter Davidge Soaking device for hay.

Also Published As

Publication number Publication date
GB1567397A (en) 1980-05-14
FR2344641A1 (fr) 1977-10-14
AT349283B (de) 1979-03-26
FR2344641B1 (de) 1980-05-23
SE7702996L (sv) 1977-09-20
DE2709788A1 (de) 1977-09-22
NL7702703A (nl) 1977-09-21
ATA178577A (de) 1978-08-15

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