JPS5212571A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5212571A
JPS5212571A JP50088327A JP8832775A JPS5212571A JP S5212571 A JPS5212571 A JP S5212571A JP 50088327 A JP50088327 A JP 50088327A JP 8832775 A JP8832775 A JP 8832775A JP S5212571 A JPS5212571 A JP S5212571A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding device
semi
make
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50088327A
Other languages
Japanese (ja)
Other versions
JPS5436832B2 (en
Inventor
Takefumi Watanabe
Soichiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50088327A priority Critical patent/JPS5212571A/en
Publication of JPS5212571A publication Critical patent/JPS5212571A/en
Publication of JPS5436832B2 publication Critical patent/JPS5436832B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To make possible the assembly of a semi-conductor device with many bonding parts, and besides, in even assembling a semi-conductor with various items, to make it possible by simple adjustment.
COPYRIGHT: (C)1977,JPO&Japio
JP50088327A 1975-07-21 1975-07-21 Wire bonding device Granted JPS5212571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50088327A JPS5212571A (en) 1975-07-21 1975-07-21 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50088327A JPS5212571A (en) 1975-07-21 1975-07-21 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS5212571A true JPS5212571A (en) 1977-01-31
JPS5436832B2 JPS5436832B2 (en) 1979-11-12

Family

ID=13939785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50088327A Granted JPS5212571A (en) 1975-07-21 1975-07-21 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5212571A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257236A (en) * 1987-04-14 1988-10-25 Mitsubishi Electric Corp Wire bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257236A (en) * 1987-04-14 1988-10-25 Mitsubishi Electric Corp Wire bonding

Also Published As

Publication number Publication date
JPS5436832B2 (en) 1979-11-12

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