JPS5240063A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5240063A
JPS5240063A JP50115618A JP11561875A JPS5240063A JP S5240063 A JPS5240063 A JP S5240063A JP 50115618 A JP50115618 A JP 50115618A JP 11561875 A JP11561875 A JP 11561875A JP S5240063 A JPS5240063 A JP S5240063A
Authority
JP
Japan
Prior art keywords
lead frame
improving
assemble
rigidity
yield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50115618A
Other languages
Japanese (ja)
Inventor
Hidekatsu Muroi
Seishiro Owaki
Akiro Hoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50115618A priority Critical patent/JPS5240063A/en
Publication of JPS5240063A publication Critical patent/JPS5240063A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To assemble a semiconductor device by using a flat lead frame having rigidity thereby improving the accuracy in relative position of semiconductor elements and leads and improving the yield of automatic wire bonding work.
COPYRIGHT: (C)1977,JPO&Japio
JP50115618A 1975-09-26 1975-09-26 Lead frame Pending JPS5240063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50115618A JPS5240063A (en) 1975-09-26 1975-09-26 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50115618A JPS5240063A (en) 1975-09-26 1975-09-26 Lead frame

Publications (1)

Publication Number Publication Date
JPS5240063A true JPS5240063A (en) 1977-03-28

Family

ID=14667102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50115618A Pending JPS5240063A (en) 1975-09-26 1975-09-26 Lead frame

Country Status (1)

Country Link
JP (1) JPS5240063A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56119665U (en) * 1980-02-13 1981-09-11
JPS58138352U (en) * 1982-03-12 1983-09-17 京セラ株式会社 Lead terminal for semiconductor package
JPS58150769U (en) * 1982-04-03 1983-10-08 株式会社東光冷熱エンジニアリング Constant temperature device for sample transportation
JPS58155582U (en) * 1982-04-09 1983-10-18 株式会社東光冷熱エンジニアリング Constant temperature device for sample transportation
JPS60111845A (en) * 1983-11-22 1985-06-18 ダイキン工業株式会社 Controller for operation of refrigerator
JPS63179558A (en) * 1987-01-21 1988-07-23 Nec Kyushu Ltd Lead frame for semiconductor device
JP2023183648A (en) * 2022-06-16 2023-12-28 富士電機株式会社 Power conversion device and method for manufacturing the power conversion device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56119665U (en) * 1980-02-13 1981-09-11
JPS58138352U (en) * 1982-03-12 1983-09-17 京セラ株式会社 Lead terminal for semiconductor package
JPS58150769U (en) * 1982-04-03 1983-10-08 株式会社東光冷熱エンジニアリング Constant temperature device for sample transportation
JPS58155582U (en) * 1982-04-09 1983-10-18 株式会社東光冷熱エンジニアリング Constant temperature device for sample transportation
JPS60111845A (en) * 1983-11-22 1985-06-18 ダイキン工業株式会社 Controller for operation of refrigerator
JPS63179558A (en) * 1987-01-21 1988-07-23 Nec Kyushu Ltd Lead frame for semiconductor device
JP2023183648A (en) * 2022-06-16 2023-12-28 富士電機株式会社 Power conversion device and method for manufacturing the power conversion device

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