JPS52127066A - Production of semiconductor ic - Google Patents

Production of semiconductor ic

Info

Publication number
JPS52127066A
JPS52127066A JP4405676A JP4405676A JPS52127066A JP S52127066 A JPS52127066 A JP S52127066A JP 4405676 A JP4405676 A JP 4405676A JP 4405676 A JP4405676 A JP 4405676A JP S52127066 A JPS52127066 A JP S52127066A
Authority
JP
Japan
Prior art keywords
semiconductor
production
layer
uppermost
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4405676A
Other languages
Japanese (ja)
Inventor
Koichi Oguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP4405676A priority Critical patent/JPS52127066A/en
Publication of JPS52127066A publication Critical patent/JPS52127066A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Abstract

PURPOSE: To obtain a bonding pad capable of taking out an external lead terminal with neither stress nor heat by forming a multi-metal layer having an uppermost Au layer.
COPYRIGHT: (C)1977,JPO&Japio
JP4405676A 1976-04-16 1976-04-16 Production of semiconductor ic Pending JPS52127066A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4405676A JPS52127066A (en) 1976-04-16 1976-04-16 Production of semiconductor ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4405676A JPS52127066A (en) 1976-04-16 1976-04-16 Production of semiconductor ic

Publications (1)

Publication Number Publication Date
JPS52127066A true JPS52127066A (en) 1977-10-25

Family

ID=12680945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4405676A Pending JPS52127066A (en) 1976-04-16 1976-04-16 Production of semiconductor ic

Country Status (1)

Country Link
JP (1) JPS52127066A (en)

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