JPS5214364A - Process for production of can-sealed power transistor - Google Patents

Process for production of can-sealed power transistor

Info

Publication number
JPS5214364A
JPS5214364A JP50090297A JP9029775A JPS5214364A JP S5214364 A JPS5214364 A JP S5214364A JP 50090297 A JP50090297 A JP 50090297A JP 9029775 A JP9029775 A JP 9029775A JP S5214364 A JPS5214364 A JP S5214364A
Authority
JP
Japan
Prior art keywords
production
power transistor
sealed power
sealed
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50090297A
Other languages
Japanese (ja)
Other versions
JPS5250510B2 (en
Inventor
Kirio Miyahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50090297A priority Critical patent/JPS5214364A/en
Publication of JPS5214364A publication Critical patent/JPS5214364A/en
Publication of JPS5250510B2 publication Critical patent/JPS5250510B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent flowing out of resin by the ring-shaped mold jig and to get complete can sealing by resistance welding.
COPYRIGHT: (C)1977,JPO&Japio
JP50090297A 1975-07-25 1975-07-25 Process for production of can-sealed power transistor Granted JPS5214364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50090297A JPS5214364A (en) 1975-07-25 1975-07-25 Process for production of can-sealed power transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50090297A JPS5214364A (en) 1975-07-25 1975-07-25 Process for production of can-sealed power transistor

Publications (2)

Publication Number Publication Date
JPS5214364A true JPS5214364A (en) 1977-02-03
JPS5250510B2 JPS5250510B2 (en) 1977-12-24

Family

ID=13994591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50090297A Granted JPS5214364A (en) 1975-07-25 1975-07-25 Process for production of can-sealed power transistor

Country Status (1)

Country Link
JP (1) JPS5214364A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57135610U (en) * 1981-02-20 1982-08-24

Also Published As

Publication number Publication date
JPS5250510B2 (en) 1977-12-24

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