JPS5215265A - Lead frame for semicoductors - Google Patents

Lead frame for semicoductors

Info

Publication number
JPS5215265A
JPS5215265A JP8109476A JP8109476A JPS5215265A JP S5215265 A JPS5215265 A JP S5215265A JP 8109476 A JP8109476 A JP 8109476A JP 8109476 A JP8109476 A JP 8109476A JP S5215265 A JPS5215265 A JP S5215265A
Authority
JP
Japan
Prior art keywords
semicoductors
lead frame
lead
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8109476A
Other languages
English (en)
Japanese (ja)
Inventor
Buikutaa Meijiyaa Rodonii
Chiyaarusu Maachin Maikuru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telcon Metals Ltd
Original Assignee
Telcon Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telcon Metals Ltd filed Critical Telcon Metals Ltd
Publication of JPS5215265A publication Critical patent/JPS5215265A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP8109476A 1975-07-24 1976-07-09 Lead frame for semicoductors Pending JPS5215265A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3105775A GB1550834A (en) 1975-07-24 1975-07-24 Semiconductor devices

Publications (1)

Publication Number Publication Date
JPS5215265A true JPS5215265A (en) 1977-02-04

Family

ID=10317319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8109476A Pending JPS5215265A (en) 1975-07-24 1976-07-09 Lead frame for semicoductors

Country Status (6)

Country Link
JP (1) JPS5215265A (it)
DE (1) DE2630695A1 (it)
FR (1) FR2319199A1 (it)
GB (1) GB1550834A (it)
HK (1) HK14980A (it)
IT (1) IT1066367B (it)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593243A (en) * 1979-01-04 1980-07-15 Nec Corp Semiconductor device
JPS5611807A (en) * 1979-07-10 1981-02-05 Nippon Mining Co Ironnbase alloy for lead wire material
JPS5750457A (en) * 1980-09-12 1982-03-24 Hitachi Metals Ltd Ic lead frame material
JPS5861677A (ja) * 1981-10-09 1983-04-12 Toshiba Corp 半導体装置
JPS599149A (ja) * 1982-07-07 1984-01-18 Daido Steel Co Ltd リ−ドフレ−ム材料
JPS60103158A (ja) * 1983-11-11 1985-06-07 Hitachi Metals Ltd Ｉｃリ−ドフレ−ム材料
JPS63287534A (ja) * 1987-05-21 1988-11-24 Mitsubishi Heavy Ind Ltd 排ガスの処理方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809883A1 (de) * 1977-10-14 1979-04-19 Plessey Inc Anschlussleiterrahmen fuer gehaeuse von halbleiterbauelementen
DE3410196A1 (de) * 1984-03-20 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Leiterband fuer die montage von integrierten schaltkreisen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514822A1 (de) * 1964-08-14 1969-06-26 Telefunken Patent Verfahren zur Herstellung einer Halbleiteranordnung
US3629668A (en) * 1969-12-19 1971-12-21 Texas Instruments Inc Semiconductor device package having improved compatibility properties
US3684464A (en) * 1970-11-04 1972-08-15 Texas Instruments Inc Composite metal laminate material and lead frame

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593243A (en) * 1979-01-04 1980-07-15 Nec Corp Semiconductor device
JPS5611807A (en) * 1979-07-10 1981-02-05 Nippon Mining Co Ironnbase alloy for lead wire material
JPS5750457A (en) * 1980-09-12 1982-03-24 Hitachi Metals Ltd Ic lead frame material
JPS5861677A (ja) * 1981-10-09 1983-04-12 Toshiba Corp 半導体装置
JPS599149A (ja) * 1982-07-07 1984-01-18 Daido Steel Co Ltd リ−ドフレ−ム材料
JPS60103158A (ja) * 1983-11-11 1985-06-07 Hitachi Metals Ltd Ｉｃリ−ドフレ−ム材料
JPS63287534A (ja) * 1987-05-21 1988-11-24 Mitsubishi Heavy Ind Ltd 排ガスの処理方法

Also Published As

Publication number Publication date
IT1066367B (it) 1985-03-04
DE2630695A1 (de) 1977-02-10
FR2319199A1 (fr) 1977-02-18
GB1550834A (en) 1979-08-22
HK14980A (en) 1980-03-28

Similar Documents

Publication Publication Date Title
JPS51112356A (en) Frame for eyeglasses
JPS5262636A (en) Metal frame device
JPS5275727A (en) Automotive frame
JPS5490738A (en) Frame for autobicycle
HU174243B (hu) Prokhodnoj karkas s naklonnymi rel'sami dlja transportirovanija
JPS51129375A (en) Picture frame
ZA766018B (en) Mounting frame
JPS5219077A (en) Lead frame assembly
JPS5215265A (en) Lead frame for semicoductors
JPS5258690A (en) Unit frame
JPS5250449A (en) Fixed parts
JPS51116774A (en) Container frame
GB1543761A (en) Rack frame
JPS5226976A (en) Picture frame
IE42267L (en) Frame synchronising
JPS5367271A (en) Frame for handlamp
CH610052A5 (en) Door frame
JPS5266013A (en) Frame structure for printer
JPS5248044A (en) Frame for lead relays
JPS5272874A (en) Receiving frame
AU1107876A (en) Frames
JPS5216746A (en) Bicycle frame
JPS5265075A (en) Grwoth stimulater for mattgrass
JPS5265844A (en) Lead relay
JPS5234349A (en) Lead relay