IT1066367B - Dispositivo a semiconduttore e telaio nonche striscia stampata formati da esso - Google Patents

Dispositivo a semiconduttore e telaio nonche striscia stampata formati da esso

Info

Publication number
IT1066367B
IT1066367B IT5056076A IT5056076A IT1066367B IT 1066367 B IT1066367 B IT 1066367B IT 5056076 A IT5056076 A IT 5056076A IT 5056076 A IT5056076 A IT 5056076A IT 1066367 B IT1066367 B IT 1066367B
Authority
IT
Italy
Prior art keywords
semiconductor
frame device
strip formed
printed strip
printed
Prior art date
Application number
IT5056076A
Other languages
English (en)
Original Assignee
Telcon Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telcon Metals Ltd filed Critical Telcon Metals Ltd
Application granted granted Critical
Publication of IT1066367B publication Critical patent/IT1066367B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
IT5056076A 1975-07-24 1976-07-22 Dispositivo a semiconduttore e telaio nonche striscia stampata formati da esso IT1066367B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3105775A GB1550834A (en) 1975-07-24 1975-07-24 Semiconductor devices

Publications (1)

Publication Number Publication Date
IT1066367B true IT1066367B (it) 1985-03-04

Family

ID=10317319

Family Applications (1)

Application Number Title Priority Date Filing Date
IT5056076A IT1066367B (it) 1975-07-24 1976-07-22 Dispositivo a semiconduttore e telaio nonche striscia stampata formati da esso

Country Status (6)

Country Link
JP (1) JPS5215265A (it)
DE (1) DE2630695A1 (it)
FR (1) FR2319199A1 (it)
GB (1) GB1550834A (it)
HK (1) HK14980A (it)
IT (1) IT1066367B (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809883A1 (de) * 1977-10-14 1979-04-19 Plessey Inc Anschlussleiterrahmen fuer gehaeuse von halbleiterbauelementen
JPS5593243A (en) * 1979-01-04 1980-07-15 Nec Corp Semiconductor device
JPS5611807A (en) * 1979-07-10 1981-02-05 Nippon Mining Co Ironnbase alloy for lead wire material
JPS5750457A (en) * 1980-09-12 1982-03-24 Hitachi Metals Ltd Ic lead frame material
JPS5861677A (ja) * 1981-10-09 1983-04-12 Toshiba Corp 半導体装置
JPS599149A (ja) * 1982-07-07 1984-01-18 Daido Steel Co Ltd リ−ドフレ−ム材料
JPS60103158A (ja) * 1983-11-11 1985-06-07 Hitachi Metals Ltd Ｉｃリ−ドフレ−ム材料
DE3410196A1 (de) * 1984-03-20 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Leiterband fuer die montage von integrierten schaltkreisen
JPH0815532B2 (ja) * 1987-05-21 1996-02-21 三菱重工業株式会社 排ガスの処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514822A1 (de) * 1964-08-14 1969-06-26 Telefunken Patent Verfahren zur Herstellung einer Halbleiteranordnung
US3629668A (en) * 1969-12-19 1971-12-21 Texas Instruments Inc Semiconductor device package having improved compatibility properties
US3684464A (en) * 1970-11-04 1972-08-15 Texas Instruments Inc Composite metal laminate material and lead frame

Also Published As

Publication number Publication date
DE2630695A1 (de) 1977-02-10
FR2319199A1 (fr) 1977-02-18
GB1550834A (en) 1979-08-22
JPS5215265A (en) 1977-02-04
HK14980A (en) 1980-03-28

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