JPS5216190A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5216190A
JPS5216190A JP50091887A JP9188775A JPS5216190A JP S5216190 A JPS5216190 A JP S5216190A JP 50091887 A JP50091887 A JP 50091887A JP 9188775 A JP9188775 A JP 9188775A JP S5216190 A JPS5216190 A JP S5216190A
Authority
JP
Japan
Prior art keywords
semiconductor device
multiplewirings
integration
degree
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50091887A
Other languages
Japanese (ja)
Inventor
Koichiro Satonaka
Masayoshi Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50091887A priority Critical patent/JPS5216190A/en
Publication of JPS5216190A publication Critical patent/JPS5216190A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: In the semiconductor integrated circuit device having multiplewirings, the bonding pad is formed on the upper part of wiring layers other than the uppermost layer. Thus, the degree of integration is improved.
COPYRIGHT: (C)1977,JPO&Japio
JP50091887A 1975-07-30 1975-07-30 Semiconductor device Pending JPS5216190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50091887A JPS5216190A (en) 1975-07-30 1975-07-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50091887A JPS5216190A (en) 1975-07-30 1975-07-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5216190A true JPS5216190A (en) 1977-02-07

Family

ID=14039058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50091887A Pending JPS5216190A (en) 1975-07-30 1975-07-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5216190A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234050A (en) * 1985-04-10 1986-10-18 Sanyo Electric Co Ltd Semiconductor integrated circuit having multilayer interconnection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234050A (en) * 1985-04-10 1986-10-18 Sanyo Electric Co Ltd Semiconductor integrated circuit having multilayer interconnection

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