JPS5380182A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5380182A
JPS5380182A JP15672476A JP15672476A JPS5380182A JP S5380182 A JPS5380182 A JP S5380182A JP 15672476 A JP15672476 A JP 15672476A JP 15672476 A JP15672476 A JP 15672476A JP S5380182 A JPS5380182 A JP S5380182A
Authority
JP
Japan
Prior art keywords
semiconductor device
pad part
upper layer
providing
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15672476A
Other languages
Japanese (ja)
Inventor
Takeo Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP15672476A priority Critical patent/JPS5380182A/en
Publication of JPS5380182A publication Critical patent/JPS5380182A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To reduce greatly the chip size by forming the bonding pad part occupying a large a area in an IC with the Al material and then providing the pad part singly to the upper layer of Al-Si wiring via an insulator film.
COPYRIGHT: (C)1978,JPO&Japio
JP15672476A 1976-12-25 1976-12-25 Semiconductor device Pending JPS5380182A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15672476A JPS5380182A (en) 1976-12-25 1976-12-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15672476A JPS5380182A (en) 1976-12-25 1976-12-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5380182A true JPS5380182A (en) 1978-07-15

Family

ID=15633936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15672476A Pending JPS5380182A (en) 1976-12-25 1976-12-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5380182A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58186967A (en) * 1982-04-26 1983-11-01 Toshiba Corp Manufacture of thin film semiconductor device
JPH02308539A (en) * 1989-05-23 1990-12-21 Hitachi Ltd Construction of electrode of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58186967A (en) * 1982-04-26 1983-11-01 Toshiba Corp Manufacture of thin film semiconductor device
JPH02308539A (en) * 1989-05-23 1990-12-21 Hitachi Ltd Construction of electrode of semiconductor device

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