JPS5219072A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5219072A
JPS5219072A JP9426275A JP9426275A JPS5219072A JP S5219072 A JPS5219072 A JP S5219072A JP 9426275 A JP9426275 A JP 9426275A JP 9426275 A JP9426275 A JP 9426275A JP S5219072 A JPS5219072 A JP S5219072A
Authority
JP
Japan
Prior art keywords
semiconductor device
thickness
specifying
strain
assembling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9426275A
Other languages
Japanese (ja)
Inventor
Hisao Nozawa
Hiroshi Yamamoto
Masatoshi Utaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9426275A priority Critical patent/JPS5219072A/en
Publication of JPS5219072A publication Critical patent/JPS5219072A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: In order to reduce the strain which is added to the final element after assembling through sealing with resin by means of specifying the thickness of Si semiconductor pellet and the material and the thickness of metal frame which holds this.
COPYRIGHT: (C)1977,JPO&Japio
JP9426275A 1975-08-04 1975-08-04 Semiconductor device Pending JPS5219072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9426275A JPS5219072A (en) 1975-08-04 1975-08-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9426275A JPS5219072A (en) 1975-08-04 1975-08-04 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5219072A true JPS5219072A (en) 1977-01-14

Family

ID=14105357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9426275A Pending JPS5219072A (en) 1975-08-04 1975-08-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5219072A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604642A (en) * 1983-03-28 1986-08-05 Kabushiki Kaisha Toshiba Fe-Ni-Cu leadframe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604642A (en) * 1983-03-28 1986-08-05 Kabushiki Kaisha Toshiba Fe-Ni-Cu leadframe

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