JPS5226189A - Semi-conductor unit of multilayer wiring structure - Google Patents

Semi-conductor unit of multilayer wiring structure

Info

Publication number
JPS5226189A
JPS5226189A JP50102192A JP10219275A JPS5226189A JP S5226189 A JPS5226189 A JP S5226189A JP 50102192 A JP50102192 A JP 50102192A JP 10219275 A JP10219275 A JP 10219275A JP S5226189 A JPS5226189 A JP S5226189A
Authority
JP
Japan
Prior art keywords
semi
multilayer wiring
wiring structure
conductor unit
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50102192A
Other languages
English (en)
Other versions
JPS5846854B2 (ja
Inventor
Koichiro Satonaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50102192A priority Critical patent/JPS5846854B2/ja
Publication of JPS5226189A publication Critical patent/JPS5226189A/ja
Publication of JPS5846854B2 publication Critical patent/JPS5846854B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/283—Reinforcing structures, e.g. bump collars

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP50102192A 1975-08-25 1975-08-25 タソウハイセンコウゾウノハンドウタイソウチ Expired JPS5846854B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50102192A JPS5846854B2 (ja) 1975-08-25 1975-08-25 タソウハイセンコウゾウノハンドウタイソウチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50102192A JPS5846854B2 (ja) 1975-08-25 1975-08-25 タソウハイセンコウゾウノハンドウタイソウチ

Publications (2)

Publication Number Publication Date
JPS5226189A true JPS5226189A (en) 1977-02-26
JPS5846854B2 JPS5846854B2 (ja) 1983-10-19

Family

ID=14320792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50102192A Expired JPS5846854B2 (ja) 1975-08-25 1975-08-25 タソウハイセンコウゾウノハンドウタイソウチ

Country Status (1)

Country Link
JP (1) JPS5846854B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181041A (ja) * 1983-03-31 1984-10-15 Toshiba Corp 半導体集積回路装置
JPS6265840U (ja) * 1985-10-16 1987-04-23
JPWO2010147187A1 (ja) * 2009-06-18 2012-12-06 ローム株式会社 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181041A (ja) * 1983-03-31 1984-10-15 Toshiba Corp 半導体集積回路装置
JPS6265840U (ja) * 1985-10-16 1987-04-23
JPWO2010147187A1 (ja) * 2009-06-18 2012-12-06 ローム株式会社 半導体装置
US10163850B2 (en) 2009-06-18 2018-12-25 Rohm Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
JPS5846854B2 (ja) 1983-10-19

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