JPS5227271A - Dye bonding device - Google Patents

Dye bonding device

Info

Publication number
JPS5227271A
JPS5227271A JP50102716A JP10271675A JPS5227271A JP S5227271 A JPS5227271 A JP S5227271A JP 50102716 A JP50102716 A JP 50102716A JP 10271675 A JP10271675 A JP 10271675A JP S5227271 A JPS5227271 A JP S5227271A
Authority
JP
Japan
Prior art keywords
bonding device
dye bonding
dye
crimping
high quality
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50102716A
Other languages
Japanese (ja)
Other versions
JPS5918861B2 (en
Inventor
Yoshiaki Fukui
Katsuyuki Kawase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50102716A priority Critical patent/JPS5918861B2/en
Publication of JPS5227271A publication Critical patent/JPS5227271A/en
Publication of JPS5918861B2 publication Critical patent/JPS5918861B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To successively perform dye bonding and crimping in packaging glass seal type ceramic case, thereby providing high quality and low price.
COPYRIGHT: (C)1977,JPO&Japio
JP50102716A 1975-08-25 1975-08-25 die bonding equipment Expired JPS5918861B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50102716A JPS5918861B2 (en) 1975-08-25 1975-08-25 die bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50102716A JPS5918861B2 (en) 1975-08-25 1975-08-25 die bonding equipment

Publications (2)

Publication Number Publication Date
JPS5227271A true JPS5227271A (en) 1977-03-01
JPS5918861B2 JPS5918861B2 (en) 1984-05-01

Family

ID=14334977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50102716A Expired JPS5918861B2 (en) 1975-08-25 1975-08-25 die bonding equipment

Country Status (1)

Country Link
JP (1) JPS5918861B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796538A (en) * 1980-12-08 1982-06-15 Toshiba Corp Processing method for component parts of semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51147960A (en) * 1975-06-02 1976-12-18 Western Electric Co Method and apparatus for thermo compression bonding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51147960A (en) * 1975-06-02 1976-12-18 Western Electric Co Method and apparatus for thermo compression bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796538A (en) * 1980-12-08 1982-06-15 Toshiba Corp Processing method for component parts of semiconductor device

Also Published As

Publication number Publication date
JPS5918861B2 (en) 1984-05-01

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