JPS5227352A - Sheet separation device - Google Patents
Sheet separation deviceInfo
- Publication number
- JPS5227352A JPS5227352A JP10302075A JP10302075A JPS5227352A JP S5227352 A JPS5227352 A JP S5227352A JP 10302075 A JP10302075 A JP 10302075A JP 10302075 A JP10302075 A JP 10302075A JP S5227352 A JPS5227352 A JP S5227352A
- Authority
- JP
- Japan
- Prior art keywords
- separation device
- sheet separation
- pellet
- separation
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000926 separation method Methods 0.000 title abstract 3
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000008188 pellet Substances 0.000 abstract 2
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: When exfoliating the pellet from adhesive sheet after cutting-off and separation, the pellet cracks and adhesive transfer can be avoided, thus performing effective sheet separation in a short time.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10302075A JPS5227352A (en) | 1975-08-27 | 1975-08-27 | Sheet separation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10302075A JPS5227352A (en) | 1975-08-27 | 1975-08-27 | Sheet separation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5227352A true JPS5227352A (en) | 1977-03-01 |
Family
ID=14342954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10302075A Pending JPS5227352A (en) | 1975-08-27 | 1975-08-27 | Sheet separation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5227352A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558088A (en) * | 1978-07-03 | 1980-01-21 | Nec Corp | Pellettize method of semi conductor wafer |
| US5269873A (en) * | 1991-08-21 | 1993-12-14 | Hoechst Aktiengesellschaft | Apparatus for peeling-off a film laminated on a carrier material |
| US6629553B2 (en) * | 1997-09-04 | 2003-10-07 | Hitachi, Ltd. | Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card |
| US6932136B1 (en) * | 2004-04-08 | 2005-08-23 | National Semiconductor Corporation | Post singulation die separation apparatus and method for bulk feeding operation |
-
1975
- 1975-08-27 JP JP10302075A patent/JPS5227352A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558088A (en) * | 1978-07-03 | 1980-01-21 | Nec Corp | Pellettize method of semi conductor wafer |
| US5269873A (en) * | 1991-08-21 | 1993-12-14 | Hoechst Aktiengesellschaft | Apparatus for peeling-off a film laminated on a carrier material |
| US6629553B2 (en) * | 1997-09-04 | 2003-10-07 | Hitachi, Ltd. | Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card |
| US6932136B1 (en) * | 2004-04-08 | 2005-08-23 | National Semiconductor Corporation | Post singulation die separation apparatus and method for bulk feeding operation |
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