JPS558088A - Pellettize method of semi conductor wafer - Google Patents

Pellettize method of semi conductor wafer

Info

Publication number
JPS558088A
JPS558088A JP8131878A JP8131878A JPS558088A JP S558088 A JPS558088 A JP S558088A JP 8131878 A JP8131878 A JP 8131878A JP 8131878 A JP8131878 A JP 8131878A JP S558088 A JPS558088 A JP S558088A
Authority
JP
Japan
Prior art keywords
tape
sticked
wafer
cohesive
cohesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8131878A
Other languages
Japanese (ja)
Inventor
Kazuo Kiyohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8131878A priority Critical patent/JPS558088A/en
Publication of JPS558088A publication Critical patent/JPS558088A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To make a handling of fine, soft and cohesive tape easy and improve a yield by breaking a wafer with a use of a cohesive tape sticked with a center-holed reinforcement.
CONSTITUTION: A wafer befoer scribe or dicing is sticked to this reinforced tape to be sticked with a cohesive tape to a detached paper 1 with a centered hole bigger than that of a wafer to be sticked to the tape. Then wafer sticked to the cohesive tape is braked. Thus, the cohesive tape is not rumpled and wrapped up to make the handling of the cohesive tape easy at the sticking and braking process of the cohesive tape.
COPYRIGHT: (C)1980,JPO&Japio
JP8131878A 1978-07-03 1978-07-03 Pellettize method of semi conductor wafer Pending JPS558088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8131878A JPS558088A (en) 1978-07-03 1978-07-03 Pellettize method of semi conductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8131878A JPS558088A (en) 1978-07-03 1978-07-03 Pellettize method of semi conductor wafer

Publications (1)

Publication Number Publication Date
JPS558088A true JPS558088A (en) 1980-01-21

Family

ID=13743043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8131878A Pending JPS558088A (en) 1978-07-03 1978-07-03 Pellettize method of semi conductor wafer

Country Status (1)

Country Link
JP (1) JPS558088A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031918A (en) * 1983-07-29 1985-02-18 関西日本電気株式会社 Adhesive sheet for dicing semiconductor wafer
JPS63288714A (en) * 1988-05-02 1988-11-25 Hitachi Ltd Dicing jig
JP2007203394A (en) * 2006-01-31 2007-08-16 Nitta Haas Inc Polishing pad

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023354B1 (en) * 1971-04-14 1975-08-07
JPS50153872A (en) * 1974-05-30 1975-12-11
JPS5227352A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Sheet separation device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023354B1 (en) * 1971-04-14 1975-08-07
JPS50153872A (en) * 1974-05-30 1975-12-11
JPS5227352A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Sheet separation device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031918A (en) * 1983-07-29 1985-02-18 関西日本電気株式会社 Adhesive sheet for dicing semiconductor wafer
JPS63288714A (en) * 1988-05-02 1988-11-25 Hitachi Ltd Dicing jig
JP2007203394A (en) * 2006-01-31 2007-08-16 Nitta Haas Inc Polishing pad

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