JPS5227387A - Forming system of multi-layer wiring - Google Patents

Forming system of multi-layer wiring

Info

Publication number
JPS5227387A
JPS5227387A JP10298275A JP10298275A JPS5227387A JP S5227387 A JPS5227387 A JP S5227387A JP 10298275 A JP10298275 A JP 10298275A JP 10298275 A JP10298275 A JP 10298275A JP S5227387 A JPS5227387 A JP S5227387A
Authority
JP
Japan
Prior art keywords
layer wiring
forming system
layer
wiring
difference area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10298275A
Other languages
Japanese (ja)
Inventor
Masao Tanaka
Masaharu Umezawa
Kenji Fukushima
Hideaki Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10298275A priority Critical patent/JPS5227387A/en
Publication of JPS5227387A publication Critical patent/JPS5227387A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To prevent layer short at stage difference area of multi-layer wiring.
COPYRIGHT: (C)1977,JPO&Japio
JP10298275A 1975-08-27 1975-08-27 Forming system of multi-layer wiring Pending JPS5227387A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10298275A JPS5227387A (en) 1975-08-27 1975-08-27 Forming system of multi-layer wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10298275A JPS5227387A (en) 1975-08-27 1975-08-27 Forming system of multi-layer wiring

Publications (1)

Publication Number Publication Date
JPS5227387A true JPS5227387A (en) 1977-03-01

Family

ID=14341917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10298275A Pending JPS5227387A (en) 1975-08-27 1975-08-27 Forming system of multi-layer wiring

Country Status (1)

Country Link
JP (1) JPS5227387A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776863A (en) * 1980-10-31 1982-05-14 Fujitsu Ltd Manufacture of semiconductor device
JPS57118108U (en) * 1981-01-12 1982-07-22
JPS5941853A (en) * 1982-08-31 1984-03-08 Fujitsu Ltd Semiconductor device and manufacture thereof
US6066553A (en) * 1995-11-03 2000-05-23 Micron Technology, Inc. Semiconductor processing method of forming electrically conductive interconnect lines and integrated circuitry
US6091150A (en) * 1996-09-03 2000-07-18 Micron Technology, Inc. Integrated circuitry comprising electrically insulative material over interconnect line tops, sidewalls and bottoms

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776863A (en) * 1980-10-31 1982-05-14 Fujitsu Ltd Manufacture of semiconductor device
JPS57118108U (en) * 1981-01-12 1982-07-22
JPS5941853A (en) * 1982-08-31 1984-03-08 Fujitsu Ltd Semiconductor device and manufacture thereof
US6066553A (en) * 1995-11-03 2000-05-23 Micron Technology, Inc. Semiconductor processing method of forming electrically conductive interconnect lines and integrated circuitry
US6432813B1 (en) 1995-11-03 2002-08-13 Micron Technology, Inc. Semiconductor processing method of forming insulative material over conductive lines
US6091150A (en) * 1996-09-03 2000-07-18 Micron Technology, Inc. Integrated circuitry comprising electrically insulative material over interconnect line tops, sidewalls and bottoms

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