JPS5240064A - Process for production of semiconductor device - Google Patents

Process for production of semiconductor device

Info

Publication number
JPS5240064A
JPS5240064A JP50115622A JP11562275A JPS5240064A JP S5240064 A JPS5240064 A JP S5240064A JP 50115622 A JP50115622 A JP 50115622A JP 11562275 A JP11562275 A JP 11562275A JP S5240064 A JPS5240064 A JP S5240064A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
peeled
stem
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50115622A
Other languages
Japanese (ja)
Inventor
Kunishige Kishi
Akira Kikuta
Mitsuo Ito
Kenji Akeyama
Yoshio Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50115622A priority Critical patent/JPS5240064A/en
Publication of JPS5240064A publication Critical patent/JPS5240064A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: A process for production of semiconductor devices wherein a solder material interposed between transistor pellet and stem is made sufficiently thick so that it is not peeled by the stress owing to thermal expansion.
COPYRIGHT: (C)1977,JPO&Japio
JP50115622A 1975-09-26 1975-09-26 Process for production of semiconductor device Pending JPS5240064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50115622A JPS5240064A (en) 1975-09-26 1975-09-26 Process for production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50115622A JPS5240064A (en) 1975-09-26 1975-09-26 Process for production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5240064A true JPS5240064A (en) 1977-03-28

Family

ID=14667201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50115622A Pending JPS5240064A (en) 1975-09-26 1975-09-26 Process for production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5240064A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4853677A (en) * 1971-11-05 1973-07-27
JPS506144A (en) * 1973-05-18 1975-01-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4853677A (en) * 1971-11-05 1973-07-27
JPS506144A (en) * 1973-05-18 1975-01-22

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