JPS524176A - Method of regulating nuclear heat conduction of electronic unit - Google Patents

Method of regulating nuclear heat conduction of electronic unit

Info

Publication number
JPS524176A
JPS524176A JP51069883A JP6988376A JPS524176A JP S524176 A JPS524176 A JP S524176A JP 51069883 A JP51069883 A JP 51069883A JP 6988376 A JP6988376 A JP 6988376A JP S524176 A JPS524176 A JP S524176A
Authority
JP
Japan
Prior art keywords
heat conduction
electronic unit
nuclear heat
regulating nuclear
regulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51069883A
Other languages
English (en)
Inventor
Shii Chiyu Richiyaado
Bii Mooran Kebin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS524176A publication Critical patent/JPS524176A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/911—Vaporization

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP51069883A 1975-06-27 1976-06-16 Method of regulating nuclear heat conduction of electronic unit Pending JPS524176A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/591,198 US4050507A (en) 1975-06-27 1975-06-27 Method for customizing nucleate boiling heat transfer from electronic units immersed in dielectric coolant

Publications (1)

Publication Number Publication Date
JPS524176A true JPS524176A (en) 1977-01-13

Family

ID=24365484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51069883A Pending JPS524176A (en) 1975-06-27 1976-06-16 Method of regulating nuclear heat conduction of electronic unit

Country Status (3)

Country Link
US (1) US4050507A (ja)
JP (1) JPS524176A (ja)
GB (1) GB1514601A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013396A (ja) * 2010-07-05 2012-01-19 Toshiba Corp 伝熱部材の製造方法および伝熱部材
JP2016114304A (ja) * 2014-12-16 2016-06-23 昭和電工株式会社 沸騰伝熱部材およびこれを用いた沸騰冷却装置
WO2023167086A1 (ja) * 2022-03-01 2023-09-07 国立大学法人九州大学 冷却器及び冷却装置

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US4159739A (en) * 1977-07-13 1979-07-03 Carrier Corporation Heat transfer surface and method of manufacture
CA1127227A (en) * 1977-10-03 1982-07-06 Ichiro Endo Liquid jet recording process and apparatus therefor
US4258783A (en) * 1977-11-01 1981-03-31 Borg-Warner Corporation Boiling heat transfer surface, method of preparing same and method of boiling
US4312012A (en) * 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4474231A (en) * 1981-08-05 1984-10-02 General Electric Company Means for increasing the critical heat flux of an immersed surface
DE3132983A1 (de) * 1981-08-20 1983-03-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zum verbinden eines halbleiterchips mit einem chiptraeger
DE3672537D1 (de) * 1985-07-18 1990-08-16 Ibm Waermeuebertragungselement und seine verwendung in einer schaltungspackung.
DE3877438T2 (de) * 1987-07-10 1993-06-03 Hitachi Ltd Halbleiter-kuehlungsapparat.
US6371199B1 (en) 1988-02-24 2002-04-16 The Trustees Of The University Of Pennsylvania Nucleate boiling surfaces for cooling and gas generation
US5351397A (en) * 1988-12-12 1994-10-04 Olin Corporation Method of forming a nucleate boiling surface by a roll forming
US5099908A (en) * 1989-07-13 1992-03-31 Thermal Management, Inc. Method and apparatus for maintaining electrically operating device temperatures
US5004973A (en) * 1989-07-13 1991-04-02 Thermal Management, Inc. Method and apparatus for maintaining electrically operating device temperatures
US5119021A (en) * 1989-07-13 1992-06-02 Thermal Management, Inc. Method and apparatus for maintaining electrically operating device temperatures
US5297621A (en) * 1989-07-13 1994-03-29 American Electronic Analysis Method and apparatus for maintaining electrically operating device temperatures
US5514906A (en) * 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
US5418345A (en) * 1994-02-28 1995-05-23 United Technologies Corporation Method for forming shaped passages
US5472043A (en) * 1994-03-22 1995-12-05 Aavid Laboratories, Inc. Two-phase component cooler with radioactive initiator
WO1995025603A1 (en) * 1994-03-23 1995-09-28 Board Of Regents, The University Of Texas System Boiling enhancement coating
US5544696A (en) * 1994-07-01 1996-08-13 The United States Of America As Represented By The Secretary Of The Air Force Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
US6167948B1 (en) 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
DE19722360A1 (de) * 1997-05-28 1998-12-03 Bayer Ag Verfahren und Vorrichtung zur Verbesserung des Wärmeüberganges
WO2002023115A2 (en) * 2000-09-15 2002-03-21 Mems Optical, Inc. Enhanced surface structures for passive immersion cooling of integrated circuits
US6744136B2 (en) 2001-10-29 2004-06-01 International Rectifier Corporation Sealed liquid cooled electronic device
ATE418673T1 (de) * 2002-12-12 2009-01-15 Perkins Engines Co Ltd Kühlungsanordnung und verfahren mit ausgewählten und ausgebildeten oberflächen zur verhinderung der veränderung von siedezustand
US7575046B2 (en) * 2003-09-18 2009-08-18 Rochester Institute Of Technology Methods for stabilizing flow in channels and systems thereof
US7677052B2 (en) * 2005-03-28 2010-03-16 Intel Corporation Systems for improved passive liquid cooling
US8334194B2 (en) * 2008-02-06 2012-12-18 Motech Americas, Llc Methods and apparatus for manufacturing semiconductor wafers
WO2009106143A1 (en) * 2008-02-29 2009-09-03 Perkins Engines Company Limited Clustered nucleate boiling cavity grid
US20090280336A1 (en) * 2008-05-08 2009-11-12 Ralf Jonczyk Semiconductor sheets and methods of fabricating the same
US20100146953A1 (en) * 2008-12-12 2010-06-17 Delphi Technologies, Inc. Exhaust gas steam generation system
FR2945337B1 (fr) * 2009-05-06 2012-05-25 Commissariat Energie Atomique Dispositif d'echange thermique a coefficient d'echange thermique augmente et procede de realisation d'un tel dispositif
US11073340B2 (en) * 2010-10-25 2021-07-27 Rochester Institute Of Technology Passive two phase heat transfer systems
US20120267077A1 (en) * 2011-04-21 2012-10-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules comprising the same
WO2014011372A2 (en) * 2012-06-19 2014-01-16 The Board Of Trustees Of The University Of Illinois, A Body Corporate And Politic Of The State Of Illinois Refrigerant repelling surfaces
RU199468U1 (ru) * 2020-03-24 2020-09-02 федеральное государственное бюджетное образовательное учреждение высшего образования "Донской государственный технический университет" (ДГТУ) Выглаживатель с комплексной системой охлаждения
TWM618807U (zh) * 2021-01-08 2021-11-01 瑞領科技股份有限公司 具有溝槽結構之雙相浸泡式沸騰器
US20230125822A1 (en) * 2021-10-27 2023-04-27 Intel Corporation Immersion cooling for integrated circuit devices
US12490410B2 (en) 2021-12-06 2025-12-02 Intel Corporation Circuit devices integrated with boiling enhancement for two-phase immersion cooling
US12382609B2 (en) * 2022-04-21 2025-08-05 Quanta Computer Inc. Nucleation surface treatment for thermal cooling
FR3152700A1 (fr) 2023-09-06 2025-03-07 EnéaD Refroidissement de systèmes électroniques en immersion par injection contrôlée de bulles d'air

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US3207209A (en) * 1962-12-28 1965-09-21 Dept Of Chemical Engineering & Means for increasing the heat transfer coefficient between a wall and boiling liquid
US3301314A (en) * 1964-03-02 1967-01-31 Gen Electric Method and means for increasing the heat transfer coefficient between a wall and boiling liquid
US3410979A (en) * 1964-05-28 1968-11-12 Burroughs Corp Method and apparatus for drilling holes by means of a focused laser beam
US3684007A (en) * 1970-12-29 1972-08-15 Union Carbide Corp Composite structure for boiling liquids and its formation
US3741292A (en) * 1971-06-30 1973-06-26 Ibm Liquid encapsulated air cooled module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013396A (ja) * 2010-07-05 2012-01-19 Toshiba Corp 伝熱部材の製造方法および伝熱部材
JP2016114304A (ja) * 2014-12-16 2016-06-23 昭和電工株式会社 沸騰伝熱部材およびこれを用いた沸騰冷却装置
WO2023167086A1 (ja) * 2022-03-01 2023-09-07 国立大学法人九州大学 冷却器及び冷却装置
JP2023127432A (ja) * 2022-03-01 2023-09-13 国立大学法人九州大学 冷却器及び冷却装置

Also Published As

Publication number Publication date
US4050507A (en) 1977-09-27
GB1514601A (en) 1978-06-14

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