JPS5245871A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5245871A
JPS5245871A JP50120706A JP12070675A JPS5245871A JP S5245871 A JPS5245871 A JP S5245871A JP 50120706 A JP50120706 A JP 50120706A JP 12070675 A JP12070675 A JP 12070675A JP S5245871 A JPS5245871 A JP S5245871A
Authority
JP
Japan
Prior art keywords
semiconductor device
protrusive electrode
interposed
cutting
manner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50120706A
Other languages
Japanese (ja)
Inventor
Tatsu Ito
Masataka Ota
Katsuo Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50120706A priority Critical patent/JPS5245871A/en
Publication of JPS5245871A publication Critical patent/JPS5245871A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Abstract

PURPOSE: To provide an underlaying metal film to be interposed between the wiring metal and protrusive electrode on a semiconductor chip in such a manner as to prevent pinholes and step-cutting, in a semiconductor device having a protrusive electrode.
COPYRIGHT: (C)1977,JPO&Japio
JP50120706A 1975-10-08 1975-10-08 Semiconductor device Pending JPS5245871A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50120706A JPS5245871A (en) 1975-10-08 1975-10-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50120706A JPS5245871A (en) 1975-10-08 1975-10-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5245871A true JPS5245871A (en) 1977-04-11

Family

ID=14792963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50120706A Pending JPS5245871A (en) 1975-10-08 1975-10-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5245871A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0446227A (en) * 1990-06-12 1992-02-17 Nhk Spring Co Ltd Fluid resistance generating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0446227A (en) * 1990-06-12 1992-02-17 Nhk Spring Co Ltd Fluid resistance generating device

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