JPS5268367A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5268367A
JPS5268367A JP50145476A JP14547675A JPS5268367A JP S5268367 A JPS5268367 A JP S5268367A JP 50145476 A JP50145476 A JP 50145476A JP 14547675 A JP14547675 A JP 14547675A JP S5268367 A JPS5268367 A JP S5268367A
Authority
JP
Japan
Prior art keywords
semiconductor device
paste layer
cost
solder material
mounting section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50145476A
Other languages
Japanese (ja)
Inventor
Kenichi Kaneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50145476A priority Critical patent/JPS5268367A/en
Publication of JPS5268367A publication Critical patent/JPS5268367A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: The silver conductor paste layer is formed at element mounting section of ceramic semiconductor element supporter, and the element is adhered tightly onto the paste layer alloy solder material composed mainly of Au-Sn-Al. In this way, low-cost and highly dependable semiconductor device can be obtained.
COPYRIGHT: (C)1977,JPO&Japio
JP50145476A 1975-12-05 1975-12-05 Semiconductor device Pending JPS5268367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50145476A JPS5268367A (en) 1975-12-05 1975-12-05 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50145476A JPS5268367A (en) 1975-12-05 1975-12-05 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5268367A true JPS5268367A (en) 1977-06-07

Family

ID=15386120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50145476A Pending JPS5268367A (en) 1975-12-05 1975-12-05 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5268367A (en)

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